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USB low-full-high speed peripherals Forum Discussions

naser
Level 1
First question asked Welcome!
Level 1

Hello,

The datasheet is not clear. Should the thermal pad on CY7C65630 be connected to GND?

Thanks!

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1 Solution
MaMi_1205306
Level 6
500 replies posted 50 solutions authored 25 likes received
Level 6

Hi,

 

The E-PAD(thermal pad, fins of TO-220) is generally connected to the lowest voltage handled by the device.

For example, a negative LDO should be connected to the input voltage (-Vin), and a dual-supply op amp should be connected to negative voltage(V-).

Sometimes the E-PAD is not connected inside the device just for heat dissipation.

If only the E-PAD is soldered and not connected anywhere on the board, the noise immunity will be reduced because it will be an high impedance pattern.

Therefore, I think that HX2LP should be connected to GND.

 

Regards,

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1 Reply
MaMi_1205306
Level 6
500 replies posted 50 solutions authored 25 likes received
Level 6

Hi,

 

The E-PAD(thermal pad, fins of TO-220) is generally connected to the lowest voltage handled by the device.

For example, a negative LDO should be connected to the input voltage (-Vin), and a dual-supply op amp should be connected to negative voltage(V-).

Sometimes the E-PAD is not connected inside the device just for heat dissipation.

If only the E-PAD is soldered and not connected anywhere on the board, the noise immunity will be reduced because it will be an high impedance pattern.

Therefore, I think that HX2LP should be connected to GND.

 

Regards,

0 Likes