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Hi
We plan to have a double reflow on our board (with a CX3).
Reflow profile is given in datasheet, but it is not written if the component can stand multiple reflow.
Is there any known issue ?
Thank you !
Best regards,
Benjamin
Solved! Go to Solution.
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Based on the package thickness and volume, the reflow temparature is 260 Degree Centigrade.
Please follow the procedure for 3x solder reflow based on JESD-A113H.
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Benjamin,
I will check internally and answer your query.
-Sridhar
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Benjamin,
Can you please answer the below query:
Are you running soldered board again and again through re-flow. Or taking part out from board?
-Sridhar
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Based on the package thickness and volume, the reflow temparature is 260 Degree Centigrade.
Please follow the procedure for 3x solder reflow based on JESD-A113H.