Does Infineon have comparison table or tools to help compare package dimensions and trade-offs?
Ideally, the comparison information would be in a table to facilitate parametric search capabilities and list:
- Package type or name (e.g. BGA, TQFP, QFN...)
- Physical package body (e.g. 8.0 x 8.0 mm)
- Recommended space on PCB (including area for landing pads. Note that a 7x7mm 48-TQFP will take more PCB area than a 8x8mm 68 -QFN due to gull wing pins on the TQFP.)
- Number of Pins
- Process technology required to use the package (this may be due to pin separation or under package soldering...)
- Which Infineon devices are offered in each package
- Other technology comparisons or notes describing tradeoffs with technologies
Any links to similar web pages, applications notes, or selection criteria would be appreciated.
Greg
