MOSFET (Si/SiC) Forum Discussions
For devices like coolmos, what should you pay attention to when doing double-pulse experiments?
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Show LessWe are considering replacing IPC70N04S5-4R6 with IAUCN04S7N030, but I have some questions regarding the SOA, so I'd like to ask.
IAUCN04S7N030 seems to be a product of new technology, with lower On resistance and larger Id compared to IPC70N04S5-4R6.
However, when looking at the SOA, it appears that IAUCN04S7N030 has weaker tolerance in the low pulse range (1~10us). What could be the reason for this?
I would like to know if it is due to structural changes, changes in evaluation, or if there are other reasons.
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Could you please confirm the following two points about TOLT?
(1) The definitions of the two types of RthJA described in the data sheet are as follows.
Since I don't have an image, could you tell me under what conditions the thermal resistance is?
In particular, it is not known which part the "6 cm² copper foil area for drain connection" refers to.
Also, is it okay to understand that it is a story about RthJA when a heat sink is attached as shown in the figure below described in AN?
・Thermal resistance, junction - ambient, 6cm² cooling area
Chip-to-atmosphere thermal resistance (when the device is placed on a 40x40x1.5mm FR4 PCB with a 6cm² copper area for drain connection)
・Thermal resistance, junction - ambient, minimal footprint
Chip-to-atmosphere thermal resistance (with device in the smallest footprint)
IPTC011N08NM5 Data Sheet
AN:TO-leaded top-side cooling (TOLT) package power MOSFET (Figure 9)
(2) Do you have any recommendations for how to measure Tc in TOLT?
I plan to install a heatsink via TIM on the top side,
I asked because I don't know which part of the TOLT to place the thermocouple to measure Tc.
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Show LessDear team,
How can i approach with failure analysis team, because in my application IRF9358 part particular date code-P305H,lot code AD60 component is getting failed only.
So please provide the failure analysis team details link
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Hello everyone
I am workinng on a simulation on LTSPICE
I made a starting model for the MOSFET IRFP4868PbF but I doesnt work well.
I am wondering is someone has one that works.
Thank You, Reb
Show LessHii guys,
I am selecting a rectification FET for my power supply.The reverse recovery charge value was not given in datasheet. it required for find the power losses of the FET.
Part ID: IMBF170R650M1XTMA1
Show LessWhere can I find a spice model for IPB068N20NM6 that is compatible with LTSpice?
IMBF170R1K0M1のゲート駆動電圧についてご教示いただけないでしょうか
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IMBF170R1K0M1
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●ご相談
電源回路の起動時にVgs=10Vで約200msほど動作することが想定されます。
上記条件での動作は仕様上問題ないでしょうか?
下記のデータシートの特性グラフをみるとVgs=12V以下では熱暴走のリスクも想定されるかと思います。
短時間であれば許容できるなどもあればご教示いただきたいです。
また、可能であれば、Vgs=10V時のON抵抗値、SOA(Ta=70℃)も展開いただけますと幸いです。
以上です、よろしくお願いいたします。
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Hello,
I configured the TLE9261 to normal mode and set CAN to normal mode with SWK mode. Watchdog did not time out, and detected that RXDCAN had input, but CANH and CANL had no output. The sample code in the forum seems to be out of date, and I can't access this website. Can I post another one? Thank you very much.
The configuration code is as follows:
uint16_t frame; frame = frame_TLE9261 (lpSPI_write, WD_CTRL, 0X06); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, M_S_CTRL, 0X3C); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, BUS_CTRL_1, 0X07); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, HW_CTRL, 0X90); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, WK_CTRL_2, 0X00); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, TIMER1_CTRL, 0X40); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, TIMER2_CTRL, 0X40); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, SW_SD_CTRL, 0X70); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, HS_CTRL_1, 0X11); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, HS_CTRL_2, 0X00); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (lpSPI_write, SWK_CTRL, 0X89); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, SWK_CDR_CTRL2, 0X01); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, SWK_CDR_CTRL1, 0X01); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, SWK_BTL1_CTRL, 0X50); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, SWK_CDR_LIMIT_H_CTRL, 0X54); lpSpI2_sendcmd (frame); frame = frame_TLE9261 (LPSPI_write, SWK_CDR_LIMIT_L_CTRL, 0X4C); lpSpI2_sendcmd (frame);
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uint16_t Frame (lpSPI_command cmd, TLE9261addr_t addr, uint16_t data) { uint16_t temp_addr = (addr & 0x7F) < < 0; uint16_t temp_cmd = (cmd & 1) < < 7; uint16_t temp_data = (data & 0xFF) < < 8; uint16_t frame = temp_addr + temp_cmd + temp_data; return frame; } |
Thank you.
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Show LessHi,
Kindly advise the acceptance criteria of the Mold Bleed on the side on the package of TO-220.
MPN: IRFB3207ZPBF
DC: 2234
Pkg type: TO-220
Regards,
Gil
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