Community Translation: TLE92104およびTLE92108の露出パッドはどのようにGNDに接続されていますか？
The exposed pad and the substrate of the die are connected through a non-conductive glue. This exposed pad is there for cooling purposes only to allow better power dissipation and shouldn't be used as an electrical GND.
To achieve the best performance in respect to cooling performance it is recommended to connect the exposed pad to a GND plane on the PCB.
