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Hi Cypress,
I have some questions and need to your confirm.
Q1) As I know, wiced_bt_dev_delete_bonded_device() API is used to remove bonding information. But I am not sure if wiced_delete_key_info_from_ram() API should be also used. As my test results, it seems that bonding information is also removed from ram by using wiced_bt_dev_delete_bonded_device() only. Right?
Q2) If possible, could you let me know the difference between these APIs?
Thanks,
Liam
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1. Yes, the two API both will remove the bonding information. They call the same function in the low level.
2. They will check the connection status. If the device is connected, the wiced_delete_key_info_from_ram() will return false and maintain the connection. The wiced_bt_dev_delete_bonded_device() will end the connection first and then delete the bonding information.
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1. Yes, the two API both will remove the bonding information. They call the same function in the low level.
2. They will check the connection status. If the device is connected, the wiced_delete_key_info_from_ram() will return false and maintain the connection. The wiced_bt_dev_delete_bonded_device() will end the connection first and then delete the bonding information.
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Hi Owen,
I understood. Thanks again for your explain.
Best Regards,
Liam