Update: To watch the recording of this event, please follow the below steps.
- Register here
- Receive email to confirm your email address (click the confirmation link)
- Receive eTicket via email (click “Access Here”)
- Watch the recordings (the recordings are linked below each session in the agenda)
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We are delighted to invite you to our Industrial Wide-Bandgap Developer Forum on 31 March 2022 – streamed to you from our studio in Munich. Registrations are free of cost; so don’t forget to register by 30 March 2022 on our event page.
What to expect?
- Technology expert session: Learn about upcoming package innovations like new design opportunities using QDPAK top-side cooling and its functional integration. Get insights into power cycling aspects when using SiC or make yourself familiar with the latest reliability aspects and chip technology like the enhanced Gen1 CoolSiC™ devices.
- Application insights: What makes CoolSiC™ and CoolGaN™ the perfect solutions for applications like on-board chargers, telecom and server SMPS, or low-power drives? We will demonstrate use cases that have already leveraged the advantages of SiC and GaN. You will get concrete hints to improve motor system performance using CoolGaN™ in Field Oriented Control motor drives and more.
- Customer cases: Do not miss the presentation from Siemens Mobility GmbH for insights into the advantages of using SiC in railway traction converters! For our panel discussion, we are honored to welcome Delta Energy Systems (Germany) GmbH. They will talk about the trends in wide-bandgap power devices for on-board chargers together with our GaN expert Dr. Gerald Deboy.
Want to know more?
To view the full agenda, and to know more about the speakers, visit the event page.
