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The Infineon XENSIVTM is the device for industrial and consumer applications: the TLI493D-W2BW. It uses our latest 3D Hall generation and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46 percent less height than previous comparable products, the sensor paves the way for new design options. Due to the small WLB-5 package (1.13 mm x 0.93 mm x 0.59 mm) and the low current consumption of 7 nA in power-down mode, the magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions. In particular, the low height of the TLI493D-W2BW is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles. It enables designs with double-sided PCBs or positioning of the sensor between two PCBs. This allows optimal use of the available space; for example, additional components can be placed above the sensor. TLI493D-W2BW is available in 4 different variants ending with A0, A1, A2 or A3. The underlying feature is the so called Bus mode configuration of this device. It’s possible to connect up to 4 sensors to one I²C bus. The specific addressing is then done via 4 different variants. TLI493D-W2BW A0, link to TLI493D-W2BW A1, link to TLI493D-W2BW A2, link to TLI493D-W2BW A3, link to
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