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etcac_3992396
Level 1
Level 1

Not sure if this is the right thread, anyway... I have to replace a BCM43455 integrated chip from a mobile circuit board, and i want to know how many air flow heat can i apply to remove the chip without damaging it, the air flow speed recommended, finally, what is the maximum exposure time for that?

Thanks in advance.

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WinstonF_61
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Moderator
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100 likes received 100 sign-ins 50 solutions authored

Hi,

Here is a link to the general Cypress guideline for soldering. https://www.cypress.com/documentation/other-resources/cypress-reflow-profile

I will get back to you if there are any specific requirements for BCM/CYW43455.

Regards
Winston

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WinstonF_61
Moderator
Moderator
Moderator
100 likes received 100 sign-ins 50 solutions authored

Hi,

Here is a link to the general Cypress guideline for soldering. https://www.cypress.com/documentation/other-resources/cypress-reflow-profile

I will get back to you if there are any specific requirements for BCM/CYW43455.

Regards
Winston