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USB superspeed peripherals Forum Discussions

beGr_3211946
Level 1
Level 1

Hi

We plan to have a double reflow on our board (with a CX3).

Reflow profile is given in datasheet, but it is not written if the component can stand multiple reflow.

Is there any known issue ?

Thank you !

Best regards,

Benjamin

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1 Solution

Based on the package thickness and volume, the reflow temparature is 260 Degree Centigrade.

Please follow the procedure for 3x solder reflow based on JESD-A113H.

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3 Replies
KandlaguntaR_36
Moderator
Moderator
Moderator
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Benjamin,

I will check internally and answer your query.

-Sridhar

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Benjamin,

Can you please answer the below query:

Are you running soldered board again and again through re-flow. Or taking part out from board?

-Sridhar

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Based on the package thickness and volume, the reflow temparature is 260 Degree Centigrade.

Please follow the procedure for 3x solder reflow based on JESD-A113H.

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