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Hello
About CY4533, It refers to the file 610-60538-01_CY4533_BCR_EVK_LAYOUT_FABRICATION_DRAWING.pdf.
There are two questions about the pad directly under the part.
Q1) When I read the Gerber, there are electrodes (Φ10.0mil x 3) directly under the parts. Is this specified for the number of VIAs? The question is on page 2/13, which is the part surrounded by the red line in the following VIA.png.
Q2) Is there a specification for the bonding ratio with the electrodes and the solder opening ratio for the square pad directly under the part? The question is on page 10/13, which is the part surrounded by the red line in the following PAD.png.
[VIA.png] [PAD.png]
Best Regards
Arai
Solved! Go to Solution.
- Labels:
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ispn:39571:1:0
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l1:314:1:0
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USBEZ-PDType-C
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Hi,
Q1) When I read the Gerber, there are electrodes (Φ10.0mil x 3) directly under the parts. Is this specified for the number of VIAs? The question is on page 2/13, which is the part surrounded by the red line in the following VIA.png.
We always recommend 3x3 via array for the CCG3PA/BCR silicon. If there is no space for 3x3 via array, then minimum via count should be 3 with 10x18 (or) 8x16. Via (10x18) means 10 mil drill and 18mil pad diameter.
Q2) Is there a specification for the bonding ratio with the electrodes and the solder opening ratio for the square pad directly under the part? The question is on page 10/13, which is the part surrounded by the red line in the following PAD.png.
There is No recommendation but Square PAD should have mask open with 3x3 via array.
Regards,
Abhilash P