About CY4533 design

[NoAr_1540581]

Hello

About CY4533,  It refers to the file 610-60538-01_CY4533_BCR_EVK_LAYOUT_FABRICATION_DRAWING.pdf.

There are two questions about the pad directly under the part.

Q1) When I read the Gerber, there are electrodes (Φ10.0mil x 3) directly under the parts. Is this specified for the number of VIAs? The question is on page 2/13, which is the part surrounded by the red line in the following VIA.png.

Q2) Is there a specification for the bonding ratio with the electrodes and the solder opening ratio for the square pad directly under the part?  The question is on page 10/13, which is the part surrounded by the red line in the following  PAD.png.

                        [VIA.png]                                            [PAD.png]

Best Regards

Arai

[Abhilash_P · Accepted solution]

Hi,

Q1) When I read the Gerber, there are electrodes (Φ10.0mil x 3) directly under the parts. Is this specified for the number of VIAs? The question is on page 2/13, which is the part surrounded by the red line in the following VIA.png.

                            We always recommend 3x3 via array for the CCG3PA/BCR silicon. If there is no space for 3x3 via array, then minimum via count should be 3 with 10x18 (or) 8x16.  Via (10x18) means 10 mil drill and 18mil pad diameter.

Q2) Is there a specification for the bonding ratio with the electrodes and the solder opening ratio for the square pad directly under the part?  The question is on page 10/13, which is the part surrounded by the red line in the following  PAD.png.

                          There is No recommendation but Square PAD should have mask open with 3x3 via array.

Regards,

Abhilash P