Studio Bluetooth Forum Discussions
Hello Cypress Support team.
[Background]
We would like to evaluate hci_audio_gateway demo on the CYBT_343026_EVAL board. For this demo, we refer to an Application Instructions written in the below file.
WICED-Studio-6.4\common\apps\demo\hci_audio_gateway\hci_control.c
[Procedure]
1. Build and download hci_audio_gateway application to the board.
2. Start ClientControl application.
2-1. Open Port on HCI UART port.
Then, "BLE Discovery" and "BR/EDR Discovery" buttons are available. And the discovery behavior works well.
2-2. Download .hcd file to the board.
Then, "BLE Discovery" and "BR/EDR Discovery" buttons become DISABLED. Those buttons are grayed-out.
[Question]
1) Is it necessary to download .hcd file for hci_audio_gateway demo?
2) If necessary, please let me know the correct procedure for this demo.
Thanks,
Yoshinori
Show Lesshi sir
i need programming for cybt-303426 module in spp mode/type that programming will work for only sending data from android mobile to/from bluetooth module and the data i need to read/write from puart.
plz help me.
Show LessHi,
We bought a cybt-343026 programmer and it failed to install the driver, could you please give us some advice? we are using win7 64 bit and windows xp 32bit system
Show LessI can pair it to the exact same headset with the exact same firmware with 3 out or 4 of our boards.
The Bluetooth module works fine otherwise. I can communicate with it just fine.
I get the error code:
HCI_CONTROL_EVENT_PAIRING_COMPLETE
Fail: 5
When I place the headset, literally on top of the bluetooth module, it sometimes pairs.
once connected, I get reasonable distance for audio, so it does not seem to be a hardware issue.
Is there an issue during pairing that we should be aware of?
thank you
Show LessHello Everyone,
I starting this discussion to get the details on the data type that we can send/receive to/on Cypress BLE chips. Actually we need to send text data from a mobile application whose length may vary and entered by user to the Cypress BLE Chip.
This data will be transferred via Bluetooth only. The sending will be a write operation on a particular characteristic of the BLE chip.
We are not sure if this is possible with data types like variable, uint128 etc. defined in the Chip or we have to follow any other approach.
1) Can we send this text data in a one go as a write operation?
2) How to configure the chip to accept this data?
Any help would be really appreciated.
Show LessHello,
Could you please help me to make a decision, I have chosen the CYBT-343026-01 module. I want to know whether this is correct module for my below requirement or not? I want to scan for BLE (which will give me data of MAC, LocalName, RSSI, etc of a nearby device) (scanner) as well as simultaneously I want to transmit the BLE signal (Transmitter) and It should be small in size.
Thanks in advance.
Regards,
Neeraj Dhekale
Show LessHi everyone
My customer got CYW20819A1KFBGES2 and developed the module.
They currently want to do an RF test,
what should I use for that FW?
Is it alright to use BLE_CYW920819EVB-02.X from Modus?
Thanks,
Yang
Show LessHello,
Can anybody help me how to Port libfixmath to WICED Studio?
Port libfixmath to WICED Smart SDK
this thread shows in Wiced smart sdk.
Show LessHi everyone
> Programmable TX Power up to +4 dBm
In the attached Datasheet, it means that the Max Tx Power is 4dBm.
As I know it is Typ.5dBm in Classic, and typ.4.5dBm in BLE,
so I think it is inconsistent.
Could you please give me an explanation?
Thanks,
Yang
Show LessI am trying to develop a BLE application utilizing CYBT-343026-01 series modules and ez-serial firmware version EZ-Serial WICED Firmware V1.1.14 .
smp_query_bonds command does not work according [1] page 113 . In [1] page 113 you say that the commands return a response with the number of bonded devices but it does not return the number and the the smp_bond_entry events. smp_bond_entry events are sent by the cypress module for each bond entry ([1] page 150). EZ-serial can store a maximum of four bonded devices .
I have proper configured with smp_set_security_parameters( [1] page 116) the pairing mode. I have managed to bond ( pair ) my phone successfully with cypress BLE module . I can confirm it from the BLE test android application which I am using . The android application is the nRF connect from Nordic Semiconductors.
https://www.nordicsemi.com/Software-and-tools/Development-Tools/nRF-Connect-for-desktop
I can confirm that my phone is bonded with the cypress module also with the android application lightBlue
https://play.google.com/store/apps/details?id=com.punchthrough.lightblueexplorer&hl=en_GB
May you suggest another android application to Test?
First I am setting the pairing mode
Send command smp_set_security_parameters (SSBP, ID=7/11)
(0xC0),(0x06),(0x07),(0x0B),(0x09),(0x00),(0x10),(0x00),(0x03),(0x01),(0x8E)
mode = 0x08 | 0x01, bonding = 0x00, keysize = 0x10 , pairprop = 0x00, io = 0x03,
flags = 0x01
Receive event
(0xC0),(0x02),(0x07),(0x0B),(0x00),(0x00),(0x6D) Response for smp_set_security_parameters (SSBP, ID=7/11)
From the user guide [1] page 117 I am reading that there are no response parameters but from the logic analyser there are one uint16_t or two uint8_t parameters which are 0x00 ,0x00 ( the 5th and 6th byte of the response. May you clarify these parameters ?
Subsequently I am bonding (pairing) with my smartphone and I am receiving these events sequence:
gap_connected (C, ID=4/5)
(0x80) (0x0F) (0x04) (0x05) (0x01) (0x63), (0xFF),(0xF9),(0x4F),(0x16),(0x53),(0x00),(0x28),(0x00),(0x00),(0x00),(0xBC),(0x02),(0x00),(0x2B) gap_connected (C, ID=4/5) conn_handle = 0x01 , address , type = 0x00 , interval = 0x0028 , slave_latency = 0x0000 , supervision_timeout = 0x02BC, bond = 0x00
(0x80),(0x05),(0x07),(0x02),(0x01),(0x00),(0x00),(0x00),(0x00),(0x28) smp_pairing_requested (P, ID=7/2) conn_handle =0x01 ,mode = 0x00, bonding =0x00 , keysize =0x00 , pairprop =0x00
(0x80),(0x03),(0x07),(0x03),(0x01),(0x00),(0x00),(0x27) smp_pairing_result (PR, ID=7/3) conn_handle =0x01 , result = 0x0000.
(0x80),(0x02),(0x07),(0x04),(0x01),(0x00),(0x27) smp_encryption_status (ENC, ID=7/4)
conn_handle =0x01 , status= 0x0000.
(0x80),(0x07),(0x04),(0x08),(0x01),(0x06),(0x00),(0x00),(0x00),(0xF4),(0x01),(0x28)
gap_connection_updated (CU, ID=4/8) conn_handle = 0x01 , interval =0x0060 , slave_latency = 0x0000 , supervision_timeout = 0x01F4
(0x80),(0x07),(0x04),(0x08),(0x01),(0x27),(0x00),(0x00),(0x00),(0xF4),(0x01),(0x49),
gap_connection_updated (CU, ID=4/8) conn_handle = 0x01 , interval =0x0027 , slave_latency = 0x0000 , supervision_timeout = 0x01F4
(0x80),(0x02),(0x04),(0x02),(0x00),(0x03),(0x24)
gap_adv_state_changed (ASC, ID=4/2) state = 0x00 , reason = 0x03
After the bonding procedure I try to read the bond entries
Send Command
(0xC0),(0x00),(0x07),(0x01),(0x61) smp_query_bonds (/QB, ID=7/1)
Receive response
(0xC0),(0x03),(0x07),(0x01),(0x00),(0x00),(0x00),(0x64), smp_query_bonds (/QB, ID=7/1) count = 0
I am not receiving smp_bond_entry event according ([1] page 150) with the bonding information for the bonded device. Also the smp_query_bonds response ([1] page 113)
Parameter Count shows Bond entries are zero.
I can see from the nRF connect that I have bonded with the device . Where is the error ? Can you clarify please ?
I have attached also the logic analyser diagram sequence2_Pairing Bug.logicdata . You can open it utilizing [2]. Or Open the attached text documents for TX and RX with the aforementioned commands ,responses and events sequence .
Thanks
Kostas
[1] EZ-Serial_WICED_Firmware_Platform_User_Guide_for_CYW2070x-based_Modules-v1.1.14 . pdf
[2] https://www.saleae.com/downloads/
Show Less