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Hi
I might chose diffrent forum, sorry.
I could not find reflow profile of [BTS7012-1EPA] and [TLE7259-3GE] in the both data sheets.
I also want to know about reflow peak tempture.
Sorry for taking your time.
Solved! Go to Solution.
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Hello,
Thanks for reaching out...
Infrared or convection reflow Solder Joint Temperature (SJT) minimum to be reached is 235°C – 245°C while not exceeding the specified Package Peak Temperature (PPT, 240°C/250°C/260°C, see J-STD-020C) of any of the components on the board is the general guideline at Infineon.
Please refer: B179-I1220-V5-7600-EU-EC
Regards,
Manuraj MR
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Hello,
Thanks for reaching out...
Infrared or convection reflow Solder Joint Temperature (SJT) minimum to be reached is 235°C – 245°C while not exceeding the specified Package Peak Temperature (PPT, 240°C/250°C/260°C, see J-STD-020C) of any of the components on the board is the general guideline at Infineon.
Please refer: B179-I1220-V5-7600-EU-EC
Regards,
Manuraj MR