SRAM Forum Discussions

Hi all.

I'd like to know Truth Table of CY7C1051H30-10ZSXI & CY7C1051DV33-10ZSXI.

CY7C1051H30 Truth Table has this condition "L X X H H" in data sheet .      But CY7C1051DV33-10ZSXI does not have this condition in data sheet.

I think that CY7C1051DV33-10ZSXI  also can support this condition of Truth Table.

Could you please tell us whether CY7C1051DV33-10ZSXI can support "L X X H H" of Truth Table ?

Do you have updated link for power calculation, it appears to be broken.

https://www.cypress.com/?docID=23984

I am using CY7C1061GE30-10BV1XI  as external RAM in the product and this RAM provides "ERR" pin which should be monitored by software.

When ERR is asserted? On correcting the data or if RAM could not correct the data? 

In my opinion, if data is corrected by ECC algorithm, then software need not do anything but if it is uncorrectable, then appropriate action should be taken.

I am looking for SER and SEL data on the CY7C1041GN30 65nm SRAM devices.

I found a document (AN54908) that says the datasheet should have this information, but I could not locate it.

Please advise.

Thank you.

In a question I posted on 4/21/2021 (Thermal resistance values for CY7C) it was stated " As per our packaging team we have simulated Theta JB which is 13.45 C/W using an 8-Layer (101.5 x 114.4 x 1.6mm) PCB."

However, this value is greater than the  data sheet Theta JA (12.23 °C/W) which does not make too much sense. For a typical FBGA package without an exposed heat sink or heat spreader, majority of the heat is removed from the base of the package. 

Can you provide some insite on this?

Hello,

I have the following questions about SRAM PN CY7C1019DV33-10VXI for use in aerospace application. This SRAM is a potential option for our design to address an obsolescence issue.

1. The datasheet indicates that the chip can be powered at -55 degC. Is there any data available on the performance variability between -55 degC & -40 degC ? 

2. What is the failure behavior at -55degC ? Will it stop operating or will there be variability in performance of the various read/write parameters ?

3. Is it possible to share the PN of the die used in this SRAM ?

4. Is there field data/reliability data available for this SRAM ?

5. Is there any information on NSEU susceptibility rates ?

6. Can Cypress support up-screening of these SRAMs to meet military temperature rating of -55 degC to +125 degC

What considerations must be made when upgrading SRAM to stay current with new technology?

Specifically, CY7C1370KVE33-167AXI appears to be the recommended replacement for CY7C1370C-167AI.

Is the KVE part a drop in replacement for the C part?

Are any physical modifications required to circuit assemblies designed for the C part?

Are any programming updates required to utilize the KVE part in existing applications designed for the C part?

Is there any data available that would minimize the requirement for regression testing?

I was not able to find any applications notes related to upgrading SRAM in existing designs. If I overlooked some existing documentation, please let me know.

Greg

This Cypress dual port ram has been discontinued.

To avoid an expensive PCB re-sipn:

Does Cypress offer a form/fit/function alternate part?

Does any manufacturer offer a  form/fit/function alternate part?

Does Cypress offer a last time buy of the CY7C026AV-25AXI?

Jim P, Senior engineer, GPMS

CY62146EV30LL-45ZSXIT ECN

catalog Rev O. , Page 18

Seems there’s many spec changes under ECN 6906316. Why there’s so many changes? 

is there  ECN 6906316 notice letter?

Hi,

can anyone pls help.

When was this part obsolete? when was the last time buy?

I still have 2019 year of manufact.  is it ok?

Best regards

Paolo