I have two thermal questions regarding CY7C2665KV18 (144-Mbit QDR II+)
1. Is the provided thermal resistance JC of 2.1 °C/W junction-to-case-TOP, or junction-to-case-BOTTOM? If it is the top, do you have the junction-to-case-BOTTOM value?
2. According to the "Test Conditions", it states the device was socketed onto a PCB. Does the provided JB (junction-to-board) value of 9.34 °C/W include the additional socket resistance? (i.e. we are not using a socket in our application. We are soldering the device directly to a PCB. Does this mean we cannot use the data sheet provided JB value?)