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SRAM

Jmar_12
Level 1
5 sign-ins First reply posted First question asked
Level 1

Hello,

I have two thermal questions regarding CY7C2665KV18 (144-Mbit QDR II+)

1. Is the provided thermal resistance JC of 2.1 °C/W junction-to-case-TOP, or junction-to-case-BOTTOM? If it is the top, do you have the junction-to-case-BOTTOM value?

2. According to the "Test Conditions", it states the device was socketed onto a PCB. Does the provided JB (junction-to-board) value of 9.34 °C/W include the additional socket resistance? (i.e. we are not using a socket in our application. We are soldering the device directly to a PCB. Does this mean we cannot use the data sheet provided JB value?)

Thank you

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PradiptaB_11
Moderator
Moderator 500 replies posted 250 solutions authored 250 replies posted
Moderator

Hi,

1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently. 

2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.

Thanks,

Pradipta.

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