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Hello,
I have two thermal questions regarding CY7C2665KV18 (144-Mbit QDR II+)
1. Is the provided thermal resistance JC of 2.1 °C/W junction-to-case-TOP, or junction-to-case-BOTTOM? If it is the top, do you have the junction-to-case-BOTTOM value?
2. According to the "Test Conditions", it states the device was socketed onto a PCB. Does the provided JB (junction-to-board) value of 9.34 °C/W include the additional socket resistance? (i.e. we are not using a socket in our application. We are soldering the device directly to a PCB. Does this mean we cannot use the data sheet provided JB value?)
Thank you
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Hi,
1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently.
2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.
Thanks,
Pradipta.
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Hi,
1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently.
2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.
Thanks,
Pradipta.
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Hello,
Thanks for the response. Were you able to check with the packaging team?
Thanks you
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Hi,
As per our packaging team we have simulated Theta JB which is 13.45 C/W using an 8-Layer (101.5 x 114.4 x 1.6mm) PCB. This might work better for your application.
Thanks,
Pradipta.