Thermal resistance values for CY7C2665KV18

Tip / Sign in to post questions, reply, level up, and achieve exciting badges. Know more

cross mob
Jmar_12
Level 1
Level 1
5 sign-ins First reply posted First question asked

Hello,

I have two thermal questions regarding CY7C2665KV18 (144-Mbit QDR II+)

1. Is the provided thermal resistance JC of 2.1 °C/W junction-to-case-TOP, or junction-to-case-BOTTOM? If it is the top, do you have the junction-to-case-BOTTOM value?

2. According to the "Test Conditions", it states the device was socketed onto a PCB. Does the provided JB (junction-to-board) value of 9.34 °C/W include the additional socket resistance? (i.e. we are not using a socket in our application. We are soldering the device directly to a PCB. Does this mean we cannot use the data sheet provided JB value?)

Thank you

0 Likes
1 Solution
PradiptaB_11
Moderator
Moderator
Moderator
500 replies posted 250 solutions authored 250 replies posted

Hi,

1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently. 

2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.

Thanks,

Pradipta.

View solution in original post

0 Likes
3 Replies
PradiptaB_11
Moderator
Moderator
Moderator
500 replies posted 250 solutions authored 250 replies posted

Hi,

1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently. 

2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.

Thanks,

Pradipta.

0 Likes

Hello,

Thanks for the response. Were you able to check with the packaging team?

Thanks you

0 Likes
PradiptaB_11
Moderator
Moderator
Moderator
500 replies posted 250 solutions authored 250 replies posted

Hi,

As per our packaging team we have simulated Theta JB which is 13.45 C/W using an 8-Layer (101.5 x 114.4 x 1.6mm) PCB. This might work better for your application.

Thanks,

Pradipta.

 

0 Likes