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SRAM

Jmar_12
New Contributor

Hello,

I have two thermal questions regarding CY7C2665KV18 (144-Mbit QDR II+)

1. Is the provided thermal resistance JC of 2.1 °C/W junction-to-case-TOP, or junction-to-case-BOTTOM? If it is the top, do you have the junction-to-case-BOTTOM value?

2. According to the "Test Conditions", it states the device was socketed onto a PCB. Does the provided JB (junction-to-board) value of 9.34 °C/W include the additional socket resistance? (i.e. we are not using a socket in our application. We are soldering the device directly to a PCB. Does this mean we cannot use the data sheet provided JB value?)

Thank you

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1 Solution
PradiptaB_11
Moderator
Moderator

Hi,

1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently. 

2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.

Thanks,

Pradipta.

View solution in original post

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3 Replies
PradiptaB_11
Moderator
Moderator

Hi,

1) The thermal resistance JC is junction to case TOP. We do not have junction to case bottom value currently. 

2) We need to check this with our packaging team. Let us confirm this with our team and get back to you.

Thanks,

Pradipta.

View solution in original post

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Jmar_12
New Contributor

Hello,

Thanks for the response. Were you able to check with the packaging team?

Thanks you

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PradiptaB_11
Moderator
Moderator

Hi,

As per our packaging team we have simulated Theta JB which is 13.45 C/W using an 8-Layer (101.5 x 114.4 x 1.6mm) PCB. This might work better for your application.

Thanks,

Pradipta.

 

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