Junction to Board Thermal Resistance for CY7C2665KV18

Jmar_12 · ‎Aug 17, 2021

In a question I posted on 4/21/2021 (Thermal resistance values for CY7C) it was stated " As per our packaging team we have simulated Theta JB which is 13.45 C/W using an 8-Layer (101.5 x 114.4 x 1.6mm) PCB."

However, this value is greater than the data sheet Theta JA (12.23 °C/W) which does not make too much sense. For a typical FBGA package without an exposed heat sink or heat spreader, majority of the heat is removed from the base of the package.

Can you provide some insite on this?

PradiptaB_11 · ‎Aug 18, 2021

Hi,

I think there was a typo from our side in the previous post. Please refer to the below values that we have with us both from simulation and measurements. A device soldered on the PCB should observe a lower Theta JB value. We believe the PCB in the data below plays a bigger role in the lower value than the socket.

Type	Simulation	Measurement
Board Mount	Soldered	Socketed
test Condition	102x114x1.6mm, 8-layer PCB	170x220×2.35mm, 8-layer PCB
Theta JA	16.11⁰C/W	12.23⁰C/W
Theta JB	11.72⁰C/W	9.34⁰C/W
Theta JC	2.1⁰C/W	2.1⁰C/W

Thanks,

Pradipta.

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Junction to Board Thermal Resistance for CY7C2665KV18

Junction to Board Thermal Resistance for CY7C2665KV18

Re: Junction to Board Thermal Resistance for CY7C2665KV18