Power Forum Discussions

I am trying to configure an imc101 to drive a BLDC compressor.
I think my configuration is correct, but the motor is not able to start.

I am attaching my current configuration, and the schematic.

Kind regards,

Hi,

I am currently working on PLECS Simulink platform about an inverter model using your SiC  IGBT with parallel diode PLECS model (IKZA75N120CH7), I am confused about the thermal chain setting in the thermal model. 

When I simulink my PLECS model, it is weird that  the circuit seems to need infinite time  until it can reach the stable state, I searched a lot and found out the problem is due to too high thermal capacity (C) in your thermal model. As you can see from following pictures, the original thermal chain is Foster type, I changed it into Cauer type according to the advice from  PLECS Userform, it can't influence the results of simulation. However from that Cauer type we can clearly see that the last 2 thermal capacity (C) is too high to cause thermal time constant of circuit too long though the thermal resistance is relatively low.

So I would like to ask, is there any reason behind setting the thermal capacity so low? Since so low thermal capacity means too high a thermal time constant, the circuit actually can't reach a stable state, so the simulation results are also not so accurate, right? Because of corresponding thermal resistance of last 2 columns is very small, so I guess it won't influence the finally junction temperature a lot. Can I just delete the too high thermal capacity columns , then the thermal time constant is suitable and the circuit can reach a stable state easily.

Thanks a lot for your answer and help.

Best regards,

Joy

I am considering providing backup power to the Vcc pin of the ILD8150XUMA1. Under normal circumstances, we plan to supply approximately 60V to the Vin pin. However, there are potential fault conditions where the voltage may drop to as low as 1V. In such situations, we want the internal logic of the chip to continue functioning normally. My question is: Will supplying a backup voltage of around 6.8V to the Vcc pin in the absence of Vin cause any issues or complications?

I understand VCC provides the output voltage from internal regulator but still can this be use to provide 6.8V externally.

I want to know whether the resistor used in the HIN and LIN is a pull-down resistor or resistor used for limiting the current to the input pins. (Reference EVAL-2ED1324S12PM1)

I did an Iposim simulation 7/3/2023 and now when I re-run it the results are different.

Here are the inputs (exactly the same both times)

Topology: DC/DC boost (module)

Device selected: FF1400R12IP4

Input voltage: 457 V

Output voltage: 681 V

Output current: 300 A

Mode: Continuous

Input inductance 0.00022 H

Switching freq: 5000 Hz

Cooling condition: Fixed temp heatsink at 65°C

Switch Q1 RGon : 1 Ohm

Switch Q1 RGoff : 1 Ohm

The results were:

07/03/2023:

Hello all,

I have used the spice model of Infineon IGBT in the MATLAB-Simulink through subcircuit to ssc function.

NOw that gives an error, because of some issues. I have tried to convert the spice model MATLAB-Simulink through subcircuit to ssc function. and it is also having errors. This might be due to the completely changed parameter notation in IGBT spice files.

Looking forward to the suggestions or different spice files.  I tried to use the TO-247 4pin IGBT spice files.

For information error message is:

Error using spiceNetlist2String
Unable to access IGBT_1200_HS3_L.lib.

Error in subcircuit2ssc

Error in subcircuit2ssc (line 31)
subcircuit2ssc(netlist,target);

Error in igbt_1200 (line 1)
subcircuit2ssc('IGBT_1200_HS3_L.lib','+IGBT_HS_ckt' );

I am using the IAUC45N04S6N070HATMA1 half-bridge in a design and am using the suggested footprint from the datasheet.  The suggested footprint has keepout areas between what appears to be thermal pads and the associated pins on the part.   I can see from the bottom image of the part that those "thermal pads" are actually connected to pins.

It would simplify the PCB routing significantly if I can route directly to the the "thermal pad" that is connected to pins 2 and 3 instead of routing directly to pins 2 and 3.  Would this be a problem?

Thanks, David

SiC Schottky diode: I have a question about IDD05SG60C.

From the description of the following material, it is said that reflow can be done up to 3 times on the preconditioning test,

How many times can it actually be reflowed?

Also, if I reflow at 160°C below 260°C, will it be counted as the number of times?

Product Qualification Report

https://www.infineon.com/dgdl/Infineon-IDD05SG60C-ProductQualificationReport-v01_00-EN.pdf?fileId=5546d4627883d7e00178d502997f7d4a 

IDD05SG60C

https://www.infineon.com/dgdl/Infineon-IDD05SG60C-DS-v02_04-en.pdf?fileId=db3a304327b897500127dd2fc4391a74

i have designed and developed a 24V 3A CV power supply board on ICL8810.

The design requirements are

1) input 100-300V AC

2) output 24V 3A

3) PF > 0.95

4) THD less than 10%

5) Efficiency  > 90%

6) Load and line regulation < 3%

I am sharing the schematic.

On turn ON, the voltmeter reads 24.045V - 230V input - no load

on setting load to 100mA the output is 23.96V

on 200mA its 22.93V and then right upto 1.2A its 22.9V

above 1.2A the output stops dropping.

at 1.7A its 18V

at 2.0A its 9V

I have checked everything but am not able to find the reason.

The transformer is as below

PQ2620 Ae 118

pin 3-1 primary 40T 0.35 x 2

pin 12-7 secondary 8T 0.35x4

pin 6-4 aux 5T  0.3x1

I have used the secondary output to TL431 directly, rest everything is used as per the ICL8810 Eval board guidelines.

would seek help to understand the load regulation issues and methods to diagnose and correct.

schematic is attached.

Thanks