How to minimize the junction temperature via PCB layout for POL devices?

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chandraprakash
Employee
Employee
First like received 5 replies posted First solution authored

How to reduce the junction temperature using PCB layout guidelines for thermal reduction on monolithic and non-monolithic POL devices

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1 Solution
Nishanth
Moderator
Moderator
Moderator
100 solutions authored 10 likes given 100 replies posted

Hello @chandraprakash ,

A good layout will reduce the switching noise, Noise pick-up, and Loop inductance, and aids thermal Dissipation.

Better thermal dissipation and reduced power dissipation will result in the reduction of junction temperature. This can be improved in POL devices by using :

  • Via holes on PVin and PGND pads 
  • Wide copper polygons  for PVin and PGND connections
  • Sufficient via holes should be used to connect power traces between different layers
  • Sufficient width and thickness of the copper pad or trace will reduce thermal dissipation
  • Heat sink for the parts having high dissipation.

Kindly refer to the layout recommendation given in the datasheet of POL devices before finalizing the PCB layout.

Regards,

Nishanth

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1 Reply
Nishanth
Moderator
Moderator
Moderator
100 solutions authored 10 likes given 100 replies posted

Hello @chandraprakash ,

A good layout will reduce the switching noise, Noise pick-up, and Loop inductance, and aids thermal Dissipation.

Better thermal dissipation and reduced power dissipation will result in the reduction of junction temperature. This can be improved in POL devices by using :

  • Via holes on PVin and PGND pads 
  • Wide copper polygons  for PVin and PGND connections
  • Sufficient via holes should be used to connect power traces between different layers
  • Sufficient width and thickness of the copper pad or trace will reduce thermal dissipation
  • Heat sink for the parts having high dissipation.

Kindly refer to the layout recommendation given in the datasheet of POL devices before finalizing the PCB layout.

Regards,

Nishanth

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