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How to reduce the junction temperature using PCB layout guidelines for thermal reduction on monolithic and non-monolithic POL devices
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Hello @chandraprakash ,
A good layout will reduce the switching noise, Noise pick-up, and Loop inductance, and aids thermal Dissipation.
Better thermal dissipation and reduced power dissipation will result in the reduction of junction temperature. This can be improved in POL devices by using :
- Via holes on PVin and PGND pads
- Wide copper polygons for PVin and PGND connections
- Sufficient via holes should be used to connect power traces between different layers
- Sufficient width and thickness of the copper pad or trace will reduce thermal dissipation
- Heat sink for the parts having high dissipation.
Kindly refer to the layout recommendation given in the datasheet of POL devices before finalizing the PCB layout.
Regards,
Nishanth
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Hello @chandraprakash ,
A good layout will reduce the switching noise, Noise pick-up, and Loop inductance, and aids thermal Dissipation.
Better thermal dissipation and reduced power dissipation will result in the reduction of junction temperature. This can be improved in POL devices by using :
- Via holes on PVin and PGND pads
- Wide copper polygons for PVin and PGND connections
- Sufficient via holes should be used to connect power traces between different layers
- Sufficient width and thickness of the copper pad or trace will reduce thermal dissipation
- Heat sink for the parts having high dissipation.
Kindly refer to the layout recommendation given in the datasheet of POL devices before finalizing the PCB layout.
Regards,
Nishanth