Dear Sirs and Madams,
Please tell us about the contents described in the application note AN85951.
Section 7.4.2 contains the following :
"You should use flex circuits with thickness 0.01 inches (0.25 mm) or higher for CapSense."
What does the 0.01 inch shown in this sentence mean?
Is it the thickness of the flexible substrate?
Or is it the thickness of the copper foil on the flexible substrate?
We would like to know what 0.01 inch refers to.
Solved! Go to Solution.
Thank you for your response.
I understood your answer.
However, We think that the thickness of a general flexible substrate is generally "12.5 to 25 um" or "0.5 to 50 mil".
厚み(理論値)：Thickness (Theoretical value)
0.01 inch = 0.254 mm
I think 0.01 inch is an order of magnitude different, but what about it?
Does that mean that the use of thin flexible boards is not recommended?
Please confirm again.
That design would be fine. The total thickness in this case as well comes up to 0.1mm for the flex PCB and this design is supported by CapSense. We have flex kits that are of the same dimension and it will work reliably.
I will work with our documents team to get the AN updated with the right value. Thank you for pointing this out...