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Our customer want to do underfill process in their PCB, could you help confirm the material is OK or not.
1. Zymet X2821 ?
2. Fuji UF317H ?
If not, could you provide the recommend underfill material.
Brian
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We has not verified the Underfill process for this module.
The provided materials, we do not have the data, but seeing from the rough description, the first one, flow-ability seems too high, the PCB edge area maybe cannot be filled well. The second one, it’s UV curing process, the gap area under the PCB cannot be cured well.
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We has not verified the Underfill process for this module.
The provided materials, we do not have the data, but seeing from the rough description, the first one, flow-ability seems too high, the PCB edge area maybe cannot be filled well. The second one, it’s UV curing process, the gap area under the PCB cannot be cured well.