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Hi everybody,
We are designing a board with the S25FL256L device. Reading through the datasheet we saw note (4) on page 6.
The notes states that we can use a single footprint for both the FAB024 and the FAC024 BGA package types.
The problem is that the location of the A1 balls in the two package types have different shifts from the edge.
This forces us to design a bigger keep out zone, and set a different shift for each device we use, something we are looking to avoid...
How do we go about designing a single footprint for both devices?
Did anybody else encounter this issue?
Thanks in advance,
Yan Rosh
Solved! Go to Solution.
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Hello Yan Rosh,
The datasheet mentions that the relative positions of signals are same between FAB024 and FAC024 packages. As you mentioned the distance of different balls from the edges are different, which you have to take care on your board.
I could find note 4 that you mentioned on page 4 of the datasheet. Please see the latest datasheet at: http://www.cypress.com/file/192131/download . Note 1 on page 40 says "1. Signal connections are in the same relative positions as FAC024 BGA, allowing a single PCB footprint to use either package."
Thanks and Regards,
Sudhesh
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Hello Yan Rosh,
The datasheet mentions that the relative positions of signals are same between FAB024 and FAC024 packages. As you mentioned the distance of different balls from the edges are different, which you have to take care on your board.
I could find note 4 that you mentioned on page 4 of the datasheet. Please see the latest datasheet at: http://www.cypress.com/file/192131/download . Note 1 on page 40 says "1. Signal connections are in the same relative positions as FAC024 BGA, allowing a single PCB footprint to use either package."
Thanks and Regards,
Sudhesh