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yejason
Employee
10 sign-ins 5 sign-ins First reply posted
Employee

Hi, I have some questions from the customer regarding the S29GL256S10TFV010 and S25FL256SDSMFV010  devices. I would appreciate it if you could help answer or point me towards the correct resources for the following for the two devices:

  • Mass
  • Encapsulation/Housing Material
  • Part CTE with Tg in correct units (typically ppm/degC).
  • Lead-frame Base Material (e.g., copper)
  • Is Lead-frame certified for AECQ?
  • Plating Materials & Thicknesses (inner layer(by%)/outer layer(by%)) [e.g., Ni 0.001-0.002µm/(98%Sn-2%Bi) 0.010-0.20µm]
  • What solder method is used? (e.g., reflow, wave (single or multi), selective)
  • Are there changes to the soldering process?  (yes/no)
  • Solder alloy composition on the circuit board (% breakdown)
  • Solder Reflow profile, if lead-free solder
  • Soldering profile part rating (max temp and time at max temp ratings)

Thanks in advance,

Jason

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1 Solution
BushraH_91
Moderator
Moderator 250 solutions authored First comment on blog 500 replies posted
Moderator

Hello,

Please see below:

  • Mass -> 10 units for package weight is 4.7367g
  • Encapsulation/Housing Material : Showa Denko CEL-9240
  • Part CTE with Tg in correct units (typically ppm/degC) : C.T.E. Alpha1: 8 / C.T.E. Alpha2: 32(PPM/degC)
  • Lead-frame Base Material (e.g., copper) : Copper
  • Is Lead-frame certified for AECQ? : Yes
  • Plating Materials & Thicknesses (inner layer(by%)/outer layer(by%)) [e.g., Ni 0.001-0.002µm/(98%Sn-2%Bi) 0.010-0.20µm] : Pure Sn 10~17.5 um.
  • What solder method is used? (e.g., reflow, wave (single or multi), selective) : NA, non solder ball package
  • Are there changes to the soldering process?  (yes/no):  NA, non solder ball package
  • Solder alloy composition on the circuit board (% breakdown) : NA, non solder ball package
  • Solder Reflow profile, if lead-free solder: NA, non solder ball package
  • Soldering profile part rating (max temp and time at max temp ratings) : NA, non solder ball package

View solution in original post

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5 Replies
BushraH_91
Moderator
Moderator 250 solutions authored First comment on blog 500 replies posted
Moderator

Hello,

Thank you for contacting Infineon Technology. Are you looking for differences between two devices (material information)?

Regards,

Bushra

 

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yejason
Employee
10 sign-ins 5 sign-ins First reply posted
Employee

Hi Bushra,

Thanks for supporting me on this customer topic.

Yes, would you be able to provide material information for both devices?

Thanks in advance,

Jason

 

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BushraH_91
Moderator
Moderator 250 solutions authored First comment on blog 500 replies posted
Moderator

Hello,

Thank you. I will check with marketing and get back to you.

Regards,

Bushra

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yejason
Employee
10 sign-ins 5 sign-ins First reply posted
Employee

Hi Bushra,

 

Have you heard back from marketing yet? The customer also asked for the wire bond material for both devices. (And if copper wire bond, is the part AECQ006 Qualified)

Thanks for your support,

Jason

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BushraH_91
Moderator
Moderator 250 solutions authored First comment on blog 500 replies posted
Moderator

Hello,

Please see below:

  • Mass -> 10 units for package weight is 4.7367g
  • Encapsulation/Housing Material : Showa Denko CEL-9240
  • Part CTE with Tg in correct units (typically ppm/degC) : C.T.E. Alpha1: 8 / C.T.E. Alpha2: 32(PPM/degC)
  • Lead-frame Base Material (e.g., copper) : Copper
  • Is Lead-frame certified for AECQ? : Yes
  • Plating Materials & Thicknesses (inner layer(by%)/outer layer(by%)) [e.g., Ni 0.001-0.002µm/(98%Sn-2%Bi) 0.010-0.20µm] : Pure Sn 10~17.5 um.
  • What solder method is used? (e.g., reflow, wave (single or multi), selective) : NA, non solder ball package
  • Are there changes to the soldering process?  (yes/no):  NA, non solder ball package
  • Solder alloy composition on the circuit board (% breakdown) : NA, non solder ball package
  • Solder Reflow profile, if lead-free solder: NA, non solder ball package
  • Soldering profile part rating (max temp and time at max temp ratings) : NA, non solder ball package
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