S25FL256SAGNFI003 Schematic question

[NL]

We are planning on using S25FL256SAGNFI003 in a new PCB design we are doing.  However, I was not able to find if the exposed pad should be connected electrically or left isolated as only a thermal pad.

Could you help identify how to electrically connect the exposed pad shown below?

(exposed pad shown):

Thanks,

-Nate

[Roy_Liu · Accepted solution]

 Hi Nate,

Please refer to this KBA - https://community.infineon.com/t5/Knowledge-Base-Articles/Exposed-Pad-Connection-in-WSON-Package-of-...

The exposed pad does not have any electrical significance and is not internally connected to the die. There is nothing electrically bonded to the pad on the bottom of the WSON package. Heat dissipation is also not a concern, even though the datasheet describes this as a heat sink slug. It is used to improve board-level reliability by attaching the pad to the board with solder. It can be connected to the ground or left unconnected.