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Hi,
We recently processed a batch of S29GL128 wafers for assembly of the die into our System-In-Package product.
The wafers were supplied with electronic wafer maps generated by wafer probe test.
The wafer map has bin codes as below, see typical example extracted from the map file:
<Bin BinCode="1" BinCount="1391" BinQuality="Pass" BinDescription="Pass"/>
<Bin BinCode="X" BinCount="79" BinQuality="Fail" BinDescription="Fail"/>
<Bin BinCode="0" BinCount="462" BinQuality="NULL" BinDescription="NULL"/>
There were 8 wafers in one lot, in a single .XML map file for the batch. And 3 wafers from another lot in a single batch .XML file.
After the sub-contractor has picked the die and made the assembly there are some strange results showing in a qty of 160 pcs.
For these 160 PCS we are seeing a different Flash-ID register entry compared with the rest of the die.
Adr 0000h: Should have been: 0001h but we found : FFFFh
Adr 0001h: Should have been: 227Eh but we found : FFFFh
Adr 000Eh: Should have been: 2221h but we found : FFFFh
Adr 000Fh: Should have been: 2201h but we found : FFFFh
- Labels:
-
Memory Nor Flash