Material information for NAND and NOR

[Roopesh]

I am from Bosch, North America. Currently working on 8” &12 “ cluster for GM which is production now.

We are working on VAVE /RPP project for the above mentioned clusters and looking for some information related to Memory chips used on the board.

In the production models, there are NOR (S29GL128S10DHB023)and NAND (S99ML04G2B043)flashes. We are replacing them with S29GL064S80DHB023 and S34ML04G200BHB003 respectively. We have already made changes on test samples and proceeding with product validation with the changes.

For GM, we need to fill out a document called part substitution matrix where certain parameters are compared between old and new parts.

Could you please provide the following details for both old and new parts.

• Coefficient of thermal expansion
• Leadframe Base Material
• Plating Materials & Thicknesses (inner layer(by%)/outer layer(by%))[e.g., Ni 0.001-0.002µm/(98%Sn-2%Bi) 0.010-0.20µm]
• Wire bond material
• Industry test standard to test the part (ex AECQ100)?

Could you please provide the information for the parts or direct me to the right contact in cypress to get this information.

[BushraH_91]

Hello Roopesh,

Thank you for contacting Cypress Technical Support, an Infineon Technologies Company. For NAND related inquiries please contact Mohammad.nada@skyhighmemory.com (Skyhigh Memory).

For NOR we are reviewing your inquiry and get back to you.

Thank you

Regards,

Bushra

[BushraH_91 · Accepted solution]

Hello Roopesh,

For NOR related information, local FAE will contact you directly.

Thank you

Regards,

Bushra