Footprint information CYRS16B512

[osch]

Hey,

We are using CYRS16B512 in a design and because there is no footprint recommendation in the datasheet it is not clear if the pins come pre-bent or we need to mill out under the chip as the mechanical drawings are showing straight legs. Also many other ceramic packages have heatsink exposed pads, does this one? Hope someone can shed some light on this, i have not been able to find info about this in the datasheet

[BushraH_91]

Hello ,

Thank you for contacting Cypress Community Forum, an Infineon Technologies Company. We are internally discussing the issue and will get back to you as soon as we find the resolution.

Thank you

Regards,

Bushra

[BushraH_91]

Hello,

The lead are straight and need to be “lead-formed” by the customer. Most customers choose a gull wing lead shape.

There are subcons like Micross Components that offer this service per unit and have already matching lead forms inhouse.

Thankyou

Regards,

Bushra

[osch]

Thank you for the reply! Does this package have a exposed pad/belly that is supposed to be soldered to the board? 

[BushraH_91 · Accepted solution]

Hello,

No paddle on the bottom side that needs to be connected.  

This is a standard 36LD Flat Pack package which does not have an exposed pad on the bottom of the package.

Thank you

Regards,

Bushra