Application question about flash S25FL128SAGN

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Anonymous
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Hi:
     I will use the flash S25FL128SAGN as the FPGA configration chip. It isn't offen operated on the board.
     The flash is 8-contact WSON package with a big exposed  thermal pad .But there is no enough space to soldering the thermal pad .  So the thermal pad isn't soldered, It's OK?
     Thank you for your reply!
 

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SudheeshK
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250 sign-ins First question asked 750 replies posted

Hi,

   

It is OK to leave the thermal pad on the 8 contact WSON package not soldered. It has no internal connections, it just adds structural integrity when soldered to the board but is not absolutely required.

   

Thanks and Regards,

   

Sudheesh

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