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IAUC80N04S6N036 layout 焊盤D,可以打通孔嗎(進行散熱)

smartconx_target@Q!w2e3r4t5y6u7i8o9p0||/t5/MOSFET-Si-SiC/mos%E4%BD%BF%E7%94%A8/td-p/672883

1 解決方案
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@haines , 您好!

可以,但要注意的是通孔的直徑和數量取決於裝置的功耗、應用和PCB的構造。具體可以參考我們的application note:

https://www.infineon.com/dgdl/Infineon-Board_Assembly_Recommendations-Discrete_Leadless-Package-v07_...

 

smartconx_target@Q!w2e3r4t5y6u7i8o9p0||/t5/MOSFET-Si-SiC/mos%E4%BD%BF%E7%94%A8/m-p/672890

在原始文章中檢視解決方案

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1 回應
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@haines , 您好!

可以,但要注意的是通孔的直徑和數量取決於裝置的功耗、應用和PCB的構造。具體可以參考我們的application note:

https://www.infineon.com/dgdl/Infineon-Board_Assembly_Recommendations-Discrete_Leadless-Package-v07_...

 

smartconx_target@Q!w2e3r4t5y6u7i8o9p0||/t5/MOSFET-Si-SiC/mos%E4%BD%BF%E7%94%A8/m-p/672890

0