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MOSFET (Si/SiC) Forum Discussions

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What function has the Interface material of CanPAKTM * package for Power MOSFET Bare Die?
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Interface material provides two functions. It fills the gap between device and heatsink and so
1. improves the intimacy on the thermal contact of the CanPAKTM and the heatsink.
2. provides electrical isolation between the drain clip which is at drain potential and the
heatsink (not required if only one device is to be heatsunk or all devices are running at
the same potential and phase).

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Not applicable
Interface material provides two functions. It fills the gap between device and heatsink and so
1. improves the intimacy on the thermal contact of the CanPAKTM and the heatsink.
2. provides electrical isolation between the drain clip which is at drain potential and the
heatsink (not required if only one device is to be heatsunk or all devices are running at
the same potential and phase).
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