Hello, I have a question abouot the Junciton-to-ambient thermal resistance of IRLR2908PbF MOSFET:
The datasheet specifies 40 °C/W referring to a note at the end of the document:
The note states that this value is valid "When mounted on 1" square PCB (FR-4 or G-10 Material)." It also says: "For recommended footprint and soldering techniques refer to application note #AN-994"
Here is my question: Is the note referring to a 1 in^2 copper pad below the device (as AN-994 recommends) or is it only the area of the PCB with the device mounted in a minimum footprint?
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