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Hi, I notice that IFX released a series of mosfets with top-side-cooling package, such as TOLT, DDPAK and QDPAK. Since the top surface should be attached on the heatsink or cool plate, I wanna know how much stress(PSI unit) the package could endure and where to find the figures? Any application note is available on the website? thanks
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您好,
针对第一个问题,40kg已经使得封装底部挨着PCB了,所以没有在此基础上继续加力。不代表封装只能承受40Kg。
针对第二个问题,之前上传的文件是针对DDPAK和QDPAK,对于TOLT请参考新的附件的page12。
额外的补充:
请注意,装配时的实际应用力应远远小于封装的最大承受力。优化的下降力应考虑到以下因素:
- PCB bending
- TIM compressed distance (thickness)
- Solder joint reliability
- Package standoff distance vs down force (related to TIM thickness)
- Others
1. PCB bending
2. TIM compressed distance vs Rth
3. Solder joint reliability
4. Package standoff distance vs down force
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您好,
感谢使用Infineon Community。
这里有两个对您很有用的AN可以参考一下。如果您关于这个话题还有其他问题,请继续联系我。
Best Regards,
Steven
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Hi Steven, 在第一个文档的page28-29描述了DDPAK的极限耐压测试。这里有两点疑问:
(1) page28提到极限压力是2500N,而Figure37的纵轴上限只到40kg(即392N),两者似乎对不上
(2) Figure37底部描述了DDPAK能通过测试,是因为海鸥脚像弹簧一样可以吸收机械应力。然而,我认为该解释仅适用于positive stand-off(如DDPAK, QDPAK),对于negative stand-off(如TOLT),是body在直接承受机械应力,Figure37的实验结果应该不适用于TOLT。而且,对于QDPAK,在0.12mm的stand-off完全吸收形变后,剩下的应力仍然是body在承受。QDPAK面积比DDPAK大很多,Figure37的数据还能沿用在QDPAK吗? 如果不能,那QDPAK和TOLT的数据有没有?
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您好,
针对第一个问题,40kg已经使得封装底部挨着PCB了,所以没有在此基础上继续加力。不代表封装只能承受40Kg。
针对第二个问题,之前上传的文件是针对DDPAK和QDPAK,对于TOLT请参考新的附件的page12。
额外的补充:
请注意,装配时的实际应用力应远远小于封装的最大承受力。优化的下降力应考虑到以下因素:
- PCB bending
- TIM compressed distance (thickness)
- Solder joint reliability
- Package standoff distance vs down force (related to TIM thickness)
- Others
1. PCB bending
2. TIM compressed distance vs Rth
3. Solder joint reliability
4. Package standoff distance vs down force