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Dear IFXer,
Could you help us to provide the assembly information for PG-TO247-4-PLUS-NT14?
Solved! Go to Solution.
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Hi,
The thermal design will consist of evaluating the power loss with respect to your application current , voltage and switching frequency. Temperature rise will depend upon Rth,HA, Tim material or iso foil used along with the clip loading force applied. You can refer to section 1.4 in the same document attached above, where thermal measurement was done with a specific heat sink of 1.2K/W and power dissipation is maintained at 50W.
Regards,
Rishabh
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Hi,
Good morning!
Please refer to:
Regards,
Rishabh
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Dear Rishabh,
thank you very much!
also that do you have any TO-247PLUS thermal design with heatsink design sample for me reference?
kind regards,
KUO
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Hi,
The thermal design will consist of evaluating the power loss with respect to your application current , voltage and switching frequency. Temperature rise will depend upon Rth,HA, Tim material or iso foil used along with the clip loading force applied. You can refer to section 1.4 in the same document attached above, where thermal measurement was done with a specific heat sink of 1.2K/W and power dissipation is maintained at 50W.
Regards,
Rishabh