In relation to power module: F3L11MR12W2M1_B65
PLECS thermal models are available on the Infineon website, however there are 3 XML files corresponding for IGBT, which XML corresponds to which device inside the package? e.g. which is the SiC MOSFET and which is the Si IGBT?
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Thanks for posting your question in the community.
The module is having 3 types of technology. that is why you can see three IGBTs and Three diodes. the explanation is given below
The simulation models with _2 can be used for Switch 2 and 3
The simulation model with _5 can used for Switch 5 and 6
The simulation model with only module name can be used for switch 1 and 4
Thanks for that info, very helpful. Also, I can see that F3L11MR12W2M1_B65 is discontinued, and that the _B74 is the latest version, do you know if the loss characteristics of the _B65 are significantly different to the _B74?