Does Infineon's full SiC modules use nano-silver sintering technology?

[Tianjianke]

Does Infineon's SiC power module package use nano-silver sintering technology? We want to buy SiC modules with nanosilver sintered package. We only see that the Easy module uses high-performance aluminum nitride (AlN) ceramics on the official website, but there is no mention of sintering technology.

[vigneshkumar]

Hi ,

Thanks for posting on Infineon community .

Could you please describe about your Application and Specification?

Regards,

Vignesh kumar

[Tianjianke]

Hello,

We want to apply SiC MOSFET power modules in transient high temperature applications, such as pulsed power supplies. Power modules packaged with ordinary solder are difficult to withstand high temperatures, while power modules sintered with nano-silver can withstand high temperatures. Therefore, we wanted to find out if Infineon's SiC modules use nano-silver sintering technology.

Thanks!

[vigneshkumar · Accepted solution]

Hi,

Infineon offers.XT technology 

CoolSiC™ MOSFETs with.XT interconnect technology for discrete packages uses a unique diffusion soldering process developed by the company that improves the performance, reliability, and lifetime of semiconductors, accelerating the adoption of energy-efficient systems and clean energy.

.XT technology eliminates the typical limitations seen through standard soldering processes. Infineon pioneered a diffusion soldering process that establishes a perfect thermal connection via the package from the chip to the heat sink.

You can refer to the below link for the list of products using .XT technology

https://www.infineon.com/cms/en/product/technology/.xt/ 

Regards

Vignesh kumar