As shown in the figure below, when I use IAUC120N06S5N017 for circuit design. If the material of the PCB used is RF4, four-layer board 2S2P, copper foil is 2OZ thickness, PCB top layer and bottom layer to increase the over-hole connection between. The back of the board to increase the heat dissipation silicone pad and heat sink. RthPCB to be how to estimate the value?
The parameters shown in the figure below are the data sheet of the device on a four-layer 2s2p FR4 PCB as defined by the JEDEC standard (JESD51-5-7). the thermal resistance of the PCB when vertical in still air is 23.3 K/W. what is the thermal resistance if a thermally conductive silicone pad and heat sink are added?
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Similar issue has been answered in the following thread. Please refer the same,