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MEMS microphones Forum Discussions

marcoB
Level 1
Level 1
5 sign-ins First solution authored First reply posted

Hi,

I'm designing a small cylindrical microphone pod, using an IM69D130 mems digital mic soldered on a small pcb.
The pcb is located on one side of the pod, with the mic hole externally exposed.
On the other side I need to fill the pod with an epoxy resin, to obtain the desired shape.

Is there some kind of shortcoming doing this?
Can the resin change the mic behavior?

Many thanks,

Marco

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GeorgeT
Moderator
Moderator
Moderator
50 solutions authored 25 likes received 5 likes given

Hi @marcoB,

Since IM69D130 is a bottom port microphone with a metal lid, filling the lid side should not have any issues.

Please verify that microphone is sealed properly to the pcb.

Please also refer to the Application note (AN557) on "MEMS microphone mechanical & acoustical
implementation" for further clarifications. 

Thanks and regards,

George 

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GeorgeT
Moderator
Moderator
Moderator
50 solutions authored 25 likes received 5 likes given

Hi @marcoB,

Since IM69D130 is a bottom port microphone with a metal lid, filling the lid side should not have any issues.

Please verify that microphone is sealed properly to the pcb.

Please also refer to the Application note (AN557) on "MEMS microphone mechanical & acoustical
implementation" for further clarifications. 

Thanks and regards,

George 

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