Version: **

Reference hardware designs of Tiger Lake platfrom for new notebooks/desktops are based on EZ-PD™ CCG5. Currently, the latest compliance test suites need firmware updates for CCG5.

This KBA describes how to pass latest compliance tests and enable the CCG6DF/SF device to work with the Tiger Lake platform. After you make the following hardware changes from CYPD5225 to CYPD6227/CYPD6228, the firmware binaries (CYPD6227-96BZXI_notebook_tgl.hex) generated by the EZ-PD™ Host SDK 3.5 example code can be used directly with the test suite.

Table 1 lists differences in device resources (hardware and firmware) between CCG5 and CCG6DF.

Table 1  Hardware and firmware features between CCG5 and CCG6DF

Based on these differences, you need to make the following hardware changes in the original reference design based on CCG5:

1. Remove CCG5’s VBUS Provider path and use the internal integrated VBUS FETs of CCG6DF. CCG6DF offers short-circuit protection (SCP) and reverse current protection (RCP) benefits with this change.
2. Pay attention to the hardware resources: current sense resistor for overcurrent protection (OCP), SCP, and RCP. The VBUS OCP current sense resistor uses 10 mΩ for CCG6DF. Load the RCP capacitance (shown in green box in Figure 1) to CSP_P (shown in red box in Figure 1) at each port of the CCG6DF design.

Figure 1     Rsense and RCP capacitance placement on CCG6DF schematic

3. CCG6DF integrates only the HS switch; SBU crossbar is not integrated. If the CCG6DF design is intended to support USB4, Thunderbolt, or both, no additional components are required. However, an SBU mux is required if the CCG5 design was targeted at supporting only USB3 and DisplayPort Alt Mode.
4. Change the VBUS FETs on the VBUS Consumer path from P-MOS FET for CCG5 to N-MOS FET for CCG6DF (see Figure 2).

Figure 2   VBUS Consumer schematic

5. See the following pinout considerations in the CCG6DF design:
   1)              CCG6DF pins connected to EC:

         
2)            CCG6DF pins connected to Tiger Lake:

3)        CCG6DF pins connected to BB re-timer:

A buck controller is the perfect selection to generate the 5V output voltage from the 12V battery line. The total amount of power is 90 W (5 V, 18 A) so a synchronous buck DC-DC would help to improve the system efficiency. Moreover, due to the relative high current output demand of up to 18 A, a multiphase buck DC-DC controller would be the perfect choice in order to split the output current between two inductors and then relax the requirements for the inductors and the switching elements.
Indeed a multiphase design allows significant flexibility for output inductor choice, which is extremely important in small form factor applications because it allows selection of a device with a smaller saturation current with the consequence that smaller inductor sizes can be selected.
Another benefit of the multiphase design is to reduce the output voltage ripple by a factor n, where n is the number of phases, without the need to increase the output filter capacitance.
Moreover a multiphase design improves also the EMC performances of the DC-DC with the consequence that BOM cost can be saved by designing smaller filters.
Infineon offers the right choice for a buck multiphase voltage regulator: the TLD5501-2QV.
TLD5501-2QV is a dual channel synchronous buck DC-DC controller explicitly designed for high power applications. The two channels can work independently or in multiphase operations. It implements an SPI interface to control and retrieve the status of the DC-DC. The switching frequency is adjustable in the range of 200 kHz to 700 kHz. It can be synchronized to an external clock source. A built-in programmable spread spectrum switching frequency modulation and the forced continuous current regulation mode improve the overall EMC behavior. Furthermore, the current mode regulation scheme provides a stable regulation loop maintained by small external compensation components. The adjustable soft start feature limits the current peak as well as voltage overshoot at start-up.
The control unit hardware implementation with the TLD5501-2QV is then shown in  https://www.infineon.com/export/sites/default/en/about-infineon/company/contacts/support/images/Figure1_TLD5501_USC_C.png Figure 1.
In https://www.infineon.com/export/sites/default/en/about-infineon/company/contacts/support/images/Figure2_TLD5501_USC_C.png Figure 2 the application diagram of the TLD5501-2QV as voltage supply in multiphase operation is shown.
For further information check the TLD5501-2QV datasheet, while more information on how to design a proper solution can be found in the  https://www.infineon.com/dgdl/Infineon-Z8F67775974_USB-C_automotive_charging_ports_with_LITIXTM-ApplicationNotes-v01_00-EN.pdf?fileId=5546d4626f229553016faed53ace64fc ack=tapplication note.

Version: **

This KBA describes the workaround for EZ-USB™ FX3 family of devices to prevent incorrect response to a warm reset LFPS. Details include trigger conditions, scope of impact, available workarounds, and silicon revision applicability. Contact your local sales representative if you have questions.

Part numbers affected

EZ-USB™ FX3 qualification status
In Production

EZ-USB™ FX3 summary
The following table defines the applicability to available EZ-USB™ FX3 family devices.

Attachments
EZ_USB_FX3_SDK_1_3_4_54_files.zip - Contains the compiled EZ-USB™ FX3 libraries and two code examples that use these library files.

Video stream not visible while streaming through EZ-USB™ CX3

Do the following to debug:

• Enable the CX3_DEBUG_ENABLED, PRINT_FRAME_INFO, and CX3_ERROR_THREAD_ENABLE macros in the cycx3_uvc.h file in your EZ-USB™ CX3 firmware project and capture the debug logs. This switch will enable debug prints over UART for printing video frame details, CX3 MIPI errors, etc.
• Open a serial terminal (Tera Term or similar) utility that gives access to the COM port.
• Set the COM port configuration as 115200 baud, no parity, 1 stop bit, no flow control, and 8-bit data to view debug prints before starting transfers.

Note: If UART cannot be used to get the debug prints, use the firmware attached with this KBA. With this firmware, the device enumerates as a composite device with CDC + UVC interface. Use serial terminal like Tera Term or any other application and then start the UVC host application.

• Check the debug prints and do the corresponding actions:

• Try setting the PHY time delay value calculated by the tool (see in right bottom corner of the MIPI receiver configuration as shown in Figure 1), using the CyU3PMipicsiSetPhyTimeDelay API.

This function is used to set the CX3_PHY_TIME_DELAY register values. See EZ-USB™ CX3 TRM for details on this register. This function should be not be called while the MIPI-CSI PLL clocks are active. Either call this API after calling CyU3PMipicsiSetIntfParams() with wakeOnConfigure set to False (before calling CyU3PMipicsiWakeup()), or call CyU3PMipicsiSleep() before calling this API.

Figure 1 Phy time delay value from CX3 MIPI receiver tool

• Check whether the video probe and commit control parameters dwMaxPayloadTransferSize and dwMaxVideoFrameSize are set correctly for the selected resolution.

• To check the total amount of data being sent out per frame, check the USB trace to find the data packets that have the end-of-frame bit set in the header.

(The second byte of the header is either 0x8E or 0x8F for the end-of-frame transfer). The total image data transferred in a frame (not including the UVC header) should be: width * height * pixel size in bytes. See points 4,5,6, and 12 of this KBA226722. These points are applicable to EZ-USB™ CX3. If this is not the amount from the USB trace, there may be an issue with the MIPI interface; that is, a mismatch in the MIPI transmitter and CX3 MIPI receiver settings.

• Verify whether the video format GUID (guidFormat) is correctly set in the format descriptor and is supported by the host OS’s UVC driver.

• If the total amount of image data is correct and a host application still does not show any images, try with a different host machine.

Reduced frames per second observed in the host application

Do the following:

1)    Verify that the HSYNC and VSYNC signals on the test points (mentioned in Q10 of this KBA91295) are behaving correctly per the chosen resolution and frame rate.

2)    Check whether commit buffer failures are observed in UART debug prints. See KBA231382 for details on how to handle these failures.

3)    Check whether the vertical blanking time is greater than 500 us.

Related Categories:

Keywords: CX3, Trouble Shooting

Product Family: CyUSB306x

Related Tags:

RAM & Timing Solutions (Clocks)

FLASH:

MCU: CAPSENSE

MCU: RTOS

MCU: SOFTWARE

 MCU: POWERLINE COMMUNICATION

MCU: BLE

MCU: Bootloader

MCU: Security

MCU: MM MCU

MCU: ANALOG

 MCU: General

Automotive : TRAVEO

Automotive: TRAVEO II

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Type C & PD:

Knowledge Base Article Type:

Document History

Document Title: EZ-USB™ CX3 troubleshooting guide - KBA233853

Document Number: 002-33853

Version: **

1. Is the XENSIV^TM PAS CO2 sensor affected by acoustic and vibration noise?
   XENSIV^TM PAS CO₂ sensor has a robust packaging, and is acoustically isolated from the surrounding noise. The sensor has been designed in such a way that only CO₂ molecules can diffuse within the measurement chamber, while significantly attenuating the surrounding noise. As shown in Figure 1, the sensor performance remains within the specifications up to 101 dB SPL for pink noise, which is one of the most common signals in biological systems and is widely present in modern-day music.
   Figure 1. Acoustic robustness of XENSIV^TM PAS CO₂
   
   

   Infineon recommends that you isolate the sensor from vibration sources. The operating frequency of the sensor is 40 Hz. If vibration is expected at exactly 40 Hz with very high acceleration (≤ 0.3 g), you should do the following to minimize the vibration impact:

   • Mount the sensor in the X-direction of vibration.
   • Enable the denoiser filter.
   • Operate the sensor in continuous mode.

However, for a typical application, the impact of vibration is minimal. As shown in Figure 2, for a test setup with three sensors mounted on a commercially available air purifier, the test result shows that with the denoiser filter enabled, the sensor is robust against the vibration generated by a different fan of the air purifier.

 Figure 2. Vibration robustness of XENSIV^TM PAS CO₂

For more details, visit the CO₂ sensor website and see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.

2. How much indoor area can be covered by one sensor for a typical application?
   Even though CO₂ is generated locally, after a certain period, the CO₂ concentration is distributed throughout the room. Therefore, irrespective of the room size and number of people, the sensor is capable of accurately estimating the indoor CO₂ concentration within an indoor environment. For more details, see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.
   
   
3. Are scientific literature available indicating the harmful effects of CO₂ for human body?
   Several studies have been done on the effect of CO₂ on the human body at various concentration levels. The summary is provided in the chart. See Source [1] for the details of the study.
   
   

   Figure 3. Impact of CO₂ on the human body at various concentration levels

   Source
   

   1. https://www.sciencedirect.com/science/article/pii/S0160412018312807
   2. https://books.google.de/books?hl=en&lr=&id=TEnO6lILSj4C&oi=fnd&pg=PR8&dq=Co2+sensors+and+health&ots=Xy1umDNsmq&sig=ZjljEpPMeRBse75NgUiwbh01KuM&redir_esc=y#v=onepage&q=Co2%20sensors%20and%20health&f=false
   3. https://ieeexplore.ieee.org/abstract/document/8767280

4. Is it possible to obtain MEMS separately from the module along with the compensation software to integrate them into a custom DSP solution?
   No, currently it is not possible to purchase MEMS separately.
   
   
5. How is the sensor calibrated? Does it need recalibration after delivery?
   Each sensor is calibrated in the factory when it is shipped from Infineon. For the final product, you  will not have to perform calibration. However, you should use the automatic baseline offset correction (ABOC) feature during operation to minimize errors due to aging. See the application note, FCS_ABOC_XENSIV™ PASCO2.
   
   
6. How can I generate a known level of CO₂ in ppm?
   CO₂ sources are numerous such as bike tire CO₂ inflators, soda water, and human breath. To arrive at a known level, capture the CO₂ gas in a Tedlar bag and pump it into a gas chamber using a 6-V diaphragm pump. CO₂ concentration can easily reach more than 10000 ppm in such a setup. A reference CO₂ sensor can be used to measure the known level. See the application note, Recommended performance evaluation methodology for XENSIV™ PAS CO2 sensor.
   
   

   One such setup is as follows:
   

7. Can the XENSIV^TM PAS CO₂ sensors be battery-powered?
   XENSIV^TM PAS CO₂ can be used for battery-powered applications. Infineon has a reference design which can help operate the sensor at 3.3 V (a low-cost boost converter circuitry along with the sensor). For details, see the application note,

   XENSIV™ PAS CO2 for low-power application.

8. When is the CO₂ sensor available? Where can I get eval kits?
   

    

   Evaluation kits are already available with major distributors.

9. What are the power requirements of the XENSIV^TM PAS CO₂ sensor?
   The average power consumption to power up the sensor is 29.7 mW. During the measurement phase, the power consumption is 26.4 mW. Infineon provides a power calculator based on Microsoft Excel that helps in determining the average power consumption based on the end application.
   

   Figure 4. Average power consumption

   For more information, see Section 3 of the application note, XENSIV™ PAS CO2 for low-power applications.

10. What is the long-term stability of these sensors?
    

     With the automatic baseline offset correction (ABOC) feature enabled, the sensor accuracy drifts by 1% every year.

    

    Figure 5. Values of pressure and acoustic stability

    See Section 4.1.5 - Transfer function table in the datasheet.

11. How can I reduce a high CO₂ level?
    According to ASHRAE, an ideal living room should not have more than 1100 ppm of CO₂. Therefore, as soon as the CO₂ level increases beyond 1100 ppm, you should ventilate the room.
    
    
12. How is the sensor calibration done?
    
    • Does the sensor calibrate single gas or more gases?
    • How long does the calibration process take?
    • What is the required equipment?
    • How often calibration must be done?
    • Can the calibration be done anywhere or only in the laboratory?
    • Does the sensor have automatic calibration or auto leveling?

Each sensor is calibrated during our production for the complete operating range. Production calibration is done with highly accurate CO₂ gas bottle and verified with an ideal reference sensor.

The sensor might show small amount of offset after assembly due to stress generated from the assembly process on the light source. Therefore, to get the best performance, this offset should be corrected using either FCS or ABOC.

For the FCS calibration, you need to have a reference sensor. In the ABOC mechanism, the device keeps track of the minimum value recorded over a week. The offset to the reference baseline is computed and used to calculate the correction factor to be applied for the week after.

Figure 6. Operation of the ABOC feature

See the application note, After-assembly calibration scheme for XENSIV™ PAS CO2 for more details.

13. Can this device be installed on a microcontroller/system-on-chip such as Arduino/Raspberry Pi?
    Yes. Infineon provides C/C++ libraries for interfacing the sensor.
    See the following GitHub repos:
    
    • For devices compatible with Arduino.
    • For PSoC™ 6 MCU library.

14. Does the response time (T63 = 75s) meet the certification requirements and accuracy for medical applications?
    The sensor is not specifically designed to cover medical applications. However, the response time is defined based on the diffusion process.
15. What are the design rules for integrating the CO₂ sensor into a package for airflow speed and direction?The device must be positioned in such a way that the diffusion of CO₂ molecules can happen easily, with a large enough opening. The recommended opening is at least 14 mm x 14 mm.
    

     

    Figure 7. Airflow direction

 See the application note, General design in guidelines for XENSIV™ PAS CO2 sensor for details.

16. What is the time constant (CO₂) of the sensor?
    Time constant/response time of the sensor is the time it takes to measure the CO₂ concentration. This is due to the diffusion time of CO₂ molecules.
    For VDD3.3 = 3.3 V, VDD12 = 12 V, Tamb = 25°C, % RH = 30 %, p = 1013 hPa, the response time, T63 = 75 seconds.
    See Section 4.1.5 of the datasheet for more information.
    
    
17. What are the response times in different airflows?
    The response time is independent of the airflow. You should not place the sensor directly within the airflow. For more details, see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.
    
    
18. How do I waterproof the sensor board for wet environments?
    The sensor is not designed for applications where it must be waterproofed. The sensor may be damaged if submerged in water.
    
    
19. Is the CO₂ sensor tested in an environmental chamber?
    A test chamber is used, which  ensures that there is no leakage, and it can maintain laminar flow while exposing the sensor to the target gas concentration. Inside the test chamber, you should accommodate a reference CO2 sensor. Additionally, to get an overview of the complete test conditions, the pressure sensor, humidity sensor, and temperature sensor should also be considered.
    For more information, see the application note, Recommended performance evaluation methodology for XENSIV™ PAS CO2 sensor.
    
    
20. Can the sensor be used within battery-driven consumer goods, with a supply voltage lower than 12V, such as 3.3 V?
    Infineon has addressed the requirement; a reference design is available to ease the design process. You can use this design to realize 12V with relatively low effort. For more information, see the application note, Reference design Sensor2Go kit, and the detailed knowledge base article (KBA).
    
    
21. What are the major technologies used in the sensor?
    The sensor uses a microphone, emitter (MEMS + filter), and the embedded software that implements the sensing algorithm

Note: For more information, see the Community webpage for CO2 sensor where you can find answers to your questions and ask your own.

Author: Ashwin Nair                 Version: **

The EZ-USB™ FX3 Explorer kit can be used as a 16-channel 100 MHz USB 3 logic analyzer with sigrok PulseView. (Note that the following steps are applicable for any FX3 device. Explorer kit is used in this KBA, as all the IOs needed are exposed in this kit as shown in Figure 1). 

Author: Mitilesh                                           Version: **

The EZ-USB™ SX3 HDMI 4K Capture Card is a USB Video Class (UVC), USB Audio Class (UAC) compliant capture card which is ideally suited for capturing video and audio from any HDMI source and supports up to 4K, 30fps/ 1080p, 60fps in YUV format video. It is based on Infineon^® EZ-USB™ SX3, a USB3.1 peripheral controller, Lattice ECP5 FPGA and HDMI receiver IC.

Figure 1. SX3 HDMI RX 4K capture card block diagram

Any HDMI source such as Laptop, Raspberry Pi, Gaming consoles, Android TV set-top box, media streaming devices like Amazon fire TV, Apple TV, and so on can be used with this kit. The “Microsoft Camera” application, e-CAMView, MPC-HC player or any UVC player application can be used to view this video on a USB Host. This is a form factor kit of size 26-mm × 75-mm.

The kit schematic, BOM, and board files are attached with this document. You can build customized board using these files.

The kit firmware configuration file includes the SX3 configuration and FPGA bit file which are attached with this document.

Figure 2. EZ-USB™ SX3 HDMI 4K capture card - Rev 01

Figure 3. Type-C and HDMI receptacles of EZ-USB™ SX3 HDMI 4K capture card – Rev 01

Follow the below steps to capture the 4K video from HDMI source using EZ-USB™ SX3 HDMI 4K Capture Card:

1. Download and install EZ-USB SX3 Configuration Utility.
2. Connect the EZ-USB™ SX3 HDMI 4K Capture Card Solution Demo Kit to USB 3 port of PC using a USB-C-to-A cable or a USB-C-to-C cable.
3. Download the SX3 Configuration file (sx3_hdmi_4K_capture_card.zip) for EZ-USB™ SX3 HDMI 4K Capture Card from the attachment.
4. Import the sx3_hdmi_4K_capture_card.zip file into SX3 Configuration Utility using the Import Configuration option.

   Figure 4. Import configuration option in SX3 configuration utility

   
5. Select USB boot mode using the boot mode selection switch (available on Rev 02 board).
6. Program the configuration to the connected kit.

   Figure 5. Program configuration option in SX3 configuration utility

   
7. Once the firmware and configuration files are loaded, select SPI boot mode using the boot mode selection switch (implemented on Rev 02 board).
8. Disconnect and re-connect the USB cable.
9. In Windows Device Manager, the kit will be visible as SX3 in the Cameras and Audio Inputs and Outputs section.

   Figure 6. SX3 devices in Device Manager after Enumeration

   
10. Connect any HDMI source to the HDMI port of the kit using the supplied HDMI cable. The HDMI source will stream video and audio. The kit will capture the same and send it over the USB port to PC.
11. To view the video from HDMI source, run the Windows Camera application and choose SX3 in the Devices option. The video from the HDMI kit will be captured on PC screen.

    Figure 7. Video played on HDMI source viewed in Windows camera application

    
12. To listen the audio from HDMI source, perform these steps:
    1. Open the Windows Control Panel.
    2. Click the Hardware and Sound icon.
    3. Click the Sound icon.
    4. Click the Recording tab.
    5. Double click on Digital Audio Interface- SX3.
    6. Click the Listen tab in the Digital Audio Interface Properties dialog box.
    7. Select the Listen to this device checkbox and click the Apply button. You should hear the audio from HDMI in Laptop speakers.
    8. Adjust your speaker volume.

Figure 8. Testing the audio from HDMI source

Figure 9. Enable “Listen to this device” option to route audio from HDMI source to the speaker

Steps to re-program the EZ-USB™ SX3 HDMI 4K Capture Card

In EZ-USB™ SX3 HDMI 4K Capture Card Revision 01, there is no provision available to change the boot option using PMODE pins. To re-program the board, the device will need to boot as USB Bootloader Device.

To erase the on-board firmware and to get back the device to bootloader mode, open the command prompt in the folder where HID_Sample_App.exe is located and enter the reset command as shown below:

HID_Sample_App.exe -vid 0x04b4 -pid 0x00c2 -reset

Replace the vid and pid values with corresponding vendor ID and product ID of the connected device. Once it is successful, the “Erase and Fallback to Bootloader is successful” message is displayed as shown in the below screenshot.

Figure 10: Reset the existing firmware using HID_Sample_App.exe

Download the HID_Sample_App.exe file from the attachments. Once the board falls back to bootloader mode, follow the procedure from step 2 to program the device.

Additional learning resources:

Visit www.cypress.com/sx3 for additional resources like datasheet, and application note, configuration utility user guide.

Attachments with EZ-USB™ SX3 HDMI 4K Capture Card Solution Demo Kit:

1. Schematic: SX3 HDMI 4K CAPTURE CARD Schematic.pdf
2. BOM: SX3 HDMI 4K CAPTURE CARD _BOM.xls
3. Board File: SX3 HDMI 4K CAPTURE CARD _layout.pdf
4. EZ-USB SX3 Configuration File: sx3_hdmi_4K_capture_card.zip
5. HID_Sample_App executable file: HID_Sample_App.zip

Version: **

The CCGx Power SDK 3.5 example firmware provides two ways:

1. Change the Retry count from 2 (default value) to 255 by using the EZ-PD™ configuration utility, and then save the configuration into firmware .hex/.cyacd file directly. You can also replace the config.c file in the firmware project and rebuild it.

2. Change the config.h file in firmware project directly without configuration table changes on Over Current Protection and rebuild the firmware project.

1. Locate the config.h file (under the solution folder of Header Files group):
2. Enable delayed infinite fault recovery.
   

    

Version: **

The PD negotiation occurs with the sink looking for the source PDO which matches the voltage according to its own capabilities, starting from the highest PDO. Depending on the current in the source PDO, two things can happen:

• If the current in the source PDO is more than the operating current of the sink, it will send a request with its own operating current and draw the same current.
• If the current in that source PDO is less than the operating current of the sink PDO, it will send a request with the operating current of the source mentioned and the "capability mismatch" bit set.

Section 6.4.2.3 of the Power Delivery specification R3 states as follows:

Capability Mismatch occurs when the sink cannot satisfy its power requirements from the capabilities offered by the source. In this case, the sink shall make a valid request from the offered capabilities and shall set the “Capability Mismatch” bit.

When a sink returns a Request Data Object in response to the advertised capabilities with this bit set, it indicates that the sink wants power that the Source cannot provide. This can be due to either a voltage that is not available or the amount of available current. At this point, the source can use the information in the request message combined with the contents of the Sink_Capabilities message to verify the voltage and current required by the sink for full operation.

When these operations are performed, a valid Request Message means the following:

1. The Object position field: It contains a reference to an object in the last received Source_Capabilities message.

2. The Operating Current/Power field: It contains a value which is less than or equal to the maximum current/power offered in the Source_Capabilities message.

3. If the Giveback flag is set to ‘0’, which indicates that there is a Maximum Operating Current/Power field:
   
   • If the Capability Mismatch bit set to ‘1’:
   • The Maximum Operating Current/Power field may contain a value larger than the maximum current/power offered in the Source_Capabilities message’s PDO as referenced by the Object Position field. This enables the sink to indicate that it requires more current/power than is being offered. If the sink requires a different voltage, this will be indicated by its

               Sink_Capabilities message.

   • If the Capability Mismatch bit set to ‘0’:
     • The Maximum Operating Current/Power field contains a value less than or equal to the maximum current/power offered in the Source_Capabilities message’s PDO as referenced by the Object Position field.

4. If the GiveBack flag is set to ‘1’, i.e., there is a Minimum Operating Current/Power field:

3. • The Minimum Operating Current/Power field contains a value less than the Operating Current/Power field.

   Example using BCR as a sink:

   This example requires the following:

   1) CY4532 EZ-PD CCG3PA evaluation kit

   2) CY4500 EZ-PD protocol analyzer

   3) CY4533 EZ-PD barrel connector replacement (BCR) evaluation kit

   Block diagram of the setup:

   

   
   Source 1 PDO available: 5V@3A and 10V@ 3A

   
   

   Figure 1. Source 1 PDO capabilities
   
   

4. BCR sink requirement: 12V
   Because the available Source PDOs were 5V and 10V, the negotiated voltage was 10V which is according to the PD specification.

5. 
   

   Figure 2. BCR Sink capability mismatch and PDO request

   
   Source 2 PDO available: 5V@ 3A and 13V@ 3A

   
   

   Figure 3. Source 2 PDO capabilities

    

   BCR sink requirement: 15V@ 3A.
   Because the available Source PDOs were 5V and 13V, the negotiated voltage is 13V, which is according to the PD specification.

   
   

   Figure 4. BCR Sink capability mismatch and PDO request

    

6.  

Original KBA: Common Errors while Programming CCG3PA using EZ-PD Configuration Utility - KBA232322

Translated by: Kenshow

==============================

タイトル： EZ-PDコンフィグレーションユーティリティを使用してCCG3PAをプログラミングする際の一般的なエラー - KBA232322

バージョン： **

質問： EZ-PDコンフィグレーションユーティリティを使用してCCG3PAをプログラミングするときに発生する一般的なエラーは何ですか？

回答： EZ-PDコンフィグレーションユーティリティは、ユーザーがCCGxコントローラを構成およびプログラムするのに役立つMicrosoftWindowsアプリケーションです。グラフィカルユーザーインターフェース（GUI）を使用すると、ユーザーはアプリケーションのさまざまなパラメータを直感的に選択して構成できます。

EZ-PDコンフィグレーションユーティリティとインストーラーの詳細については、https：//www.cypress.com/documentation/software-and-drivers/ez-pd-configuration-utilityにアクセスしてください。

CY4532 EZ-PD CCG3PAEVKでのプログラミング設定

CY4532 EZ-PD CCG3PA EVKは、CCG3PAコントローラを備えたメインボードと、メインボードに必要な電源を供給する電源ボードで構成されています。電源ボードもサイプレスCCG4コントローラで構成されており、EZ-PDコンフィグレーションユーティリティを使用してメインボードにあるCCG3PAにファームウェアをダウンロードできます。CCラインを使用してCCG3PAデバイスに接続されます。CCG4コントローラはI2Cを介してサイプレスUSBシリアルデバイス（電源ボード上にあります）に接続され、EZ-PDコンフィグレーションユーティリティからCCG3PAファームウェアを受信します。CY4532EVKでCCG3PAコントローラをプログラムするために必要な接続を図1に示します。

図1. CY4532EVKでのCCG3PAコントローラプログラミングセットアップ

プログラミング中の一般的なエラー

以下は、EZ-PDコンフィグレーションユーティリティを使用してCCG3PAをプログラミングしているときにユーザーが遭遇する一般的なエラー、考えられる理由、および解決策です。

1. EZ-PDコンフィグレーションユーティリティはデバイスを検出できません。CY4532 EVKの電源ボードはEZ-PDコンフィグレーションユーティリティによって検出されますが、プログラムされるデバイス（メインボード）は検出されません。

図2. EZ-PDコンフィグレーションユーティリティでメインボードが検出されない

表1. プログラミング中のメインボードの検出エラーの解決策

2. プログラムするデバイス（メインボード）はグレー表示されており、ファームウェアの更新中にEZ-PDコンフィグレーションユーティリティで選択することはできません。

図3. メインボード上のCCG3PAコントローラがEZ-PDコンフィグレーションユーティリティでグレー表示されている

コンフィグレーションユーティリティログ：

PD contract established.
Error: No response to GET_SILICON_ID U_VDM
Retrying, ignore the above error message
Error: Flashing VID (4b4) not found in Discover SVID Response 

表2. プログラミング中にデバイスが非アクティブ化されるというエラーの解決策

3. ファームウェアの更新は30％完了で失敗し、EZ-PDコンフィグレーションユーティリティログに「Failed to find valid firmware for update」というエラーが表示されます。

図4. EZ-PDコンフィグレーションユーティリティでのファームウェア更新の失敗

表3. ファームウェアの更新に失敗した場合の解決策

4. フラッシュ更新手順が失敗します。RESET後にPD契約が確立されていません。

表4. フラッシュ更新エラーの解決策

5. 更新されたファームウェアイメージが無効です。フラッシュ更新手順が失敗しました。

図5. 破損したファームウェアでプログラムしたときに表示されるエラーメッセージ

 表5.フラッシュ更新手順の失敗によるエラーの解決策