Version: **

Question: Is it possible to stream video from two image sensors using one EZ-USB™ FX3?

Answer:

Yes. You can use a FX3+FPGA solution. A slave FIFO interface can be used to communicate with the FPGA
(refer to AN65974 - Designing with the EZ-USB FX3 Slave FIFO Interface for more details on slave FIFO interface). Streaming from two image sensors using one FX3 can be done by creating two DMA channels.

For example, if two DMA channels created are as follows:

DMA channel - 1 with Producer sockets as CY_U3P_PIB_SOCKET_0, CY_U3P_PIB_SOCKET_1 and Consumer socket as CY_U3P_UIB_SOCKET_CONS_1

DMA channel - 2 with Producer sockets as CY_U3P_PIB_SOCKET_2, CY_U3P_PIB_SOCKET_3 and Consumer socket as CY_U3P_UIB_SOCKET_CONS_2

The FPGA can maintain two FIFOs to store data from the two image sensors. The FPGA code should change the address lines (A0 & A1) depending upon the FIFO from which it fetches the data from and send to FX3.
The sensor1 data should be stored in FIFO 1 of the FPGA and sensor2 data should be stored in FIFO 2 of the FPGA.

During the blanking period, FPGA can switch the FIFO and change the address lines to select the appropriate DMA channel of FX3 for streaming the data; that is, if the data is coming from FIFO 1, the 2-bit address line A0:A1 should be driven with 00 or 01 alternatively i.e. in ping-pong manner to select CY_U3P_PIB_SOCKET_0 or CY_U3P_PIB_SOCKET_1 of DMA channel 1.

Similarly, if the data is coming from FIFO 2, then the FPGA should drive the 2-bit address lines A0:A1 as 10 or 11 alternatively to select CY_U3P_PIB_SOCKET_2 or CY_U3P_PIB_SOCKET_3 of DMA channel 2.

Note: Refer to sections 3 and 4 of the AN75779 - How to implement an image sensor interface using EZ-USB FX3 in a USB video class (UVC) framework to understand ping-pong DMA buffer.

The video data received by the PIB sockets corresponding to the DMA channel as mentioned in the above example, will be transferred to USB block through DMA channel. As two video streams from two sensors will be streamed using two DMA channels, the device should enumerate as a composite device with two UVC interfaces i.e. FX3-UVC-1 and FX3-UVC-2. In the host application like AmCap, VLC media player, user will get option to choose a UVC interface to start streaming video. If streaming from both the sensors is to be started simultaneously, two instances of host application should be opened and appropriate UVC interface should be selected.

Figure 1. Composite device with two UVC interface

For the device to enumerate with two UVC interfaces, the USB descriptors should be modified to support two sets of UVC descriptors. In addition to this, the firmware should also handle UVC specific requests for both the interfaces.

A template firmware with two UVC interfaces and UVC specific request handling is attached with this KBA. The header file for GPIF state machine (cyfxgpif2config.h) used with the firmware is a dummy state machine. The user is expected to use a custom GPIF state machine header file based on the application. Two CY_U3P_DMA_TYPE_MANUAL_MANY_TO_ONE DMA channels are used in the firmware to stream two 640* 480 (VGA) YUY2 at 30 FPS video streams. As per the default AN75779 UVC firmware, the UVC header is added in the firmware. The cyu3imagesensor.c and cyu3imgagesensor.h are also created and saved in this project. The cyu3imagesensor.c file is used to configure and control the image sensor and FPGA. In this file, some structures are defined without a valid value. You need to replace these values with actual settings. Generally, used APIs such as CyFx3_ImageSensor_Sleep, CyFx3_ImageSensor_Wakeup, and CyFx3_ImageSensor_Trigger_Autofocus are also available the cyu3imagesensor.c and cyu3imagesensor.h files. Add the corresponding codes into these definitions.

Note: The firmware attached with the KBA is a template project and should be modified according to user application.

Version: *A

A reference design kit based on Infineon’s EZ-USB™ CX3 USB 3.0 camera controller and EN801/EN805 image signal processor (ISP) from the Eyenix website. This camera kit uses an IMX307 image sensor from Sony with a manual focus lens.

  Figure 1. Kit block diagram

Eyenix ISP has a 4-lane MIPI-CSI2 RX interface for connecting image sensors and a 4-lane MIPI CSI-2 TX interface for connecting to EZ-USB™ CX3.

Infineon EZ-USB™ CX3 enables USB 3.0 connectivity to EN801/EN805 using a MIPI-CSI2 interface with data speed up to 1 Gbps per lane.

 Figure 2. Kit photo

Key features of the kit:

• Bandwidth: 4x CSI-2 lanes, 1 Gbps per lane
• Color formats supported: YUV422 8-bit
• USB camera protocol: UVC
• Supported resolutions:
  
  • 720p @30/50fps
  • 1080p @25/30fps
  • 1080p @50/60fps
  • 1440p @25/30fps (supported by EN805 + IMX335)

Eyenix EN801/EN805 ISP has the following features:

• RGB interpolation
• WDR
• Digital noise reduction
• Adaptive contrast enhance (ACE)
• Histogram equalizer for defog
• Lens shading compensation
• Down and up scaler
• Defect pixel correction
• Hue controller
• High light masking
• Auto exposure, Auto white balance, Auto focus
• Edge enhancement
• Gamma correction
• On-screen display (OSD)
• Adaptive lighting control

The kit also supports control through an on-screen display (OSD) menu. This menu can be navigated using the Python-based camera control tool as shown in Figure 3. The tool controls the ISP menu via USB CDC class through a PC.

  Figure 3. Menu control tool

Figure 4. On-screen display (OSD) menu

See the Eyenix website for more information on this camera control software and applications including surveillance cameras, webcams, document scanners, and machine vision systems.

Version: **

1. Is the XENSIV^TM PAS CO2 sensor affected by acoustic and vibration noise?
   XENSIV^TM PAS CO₂ sensor has a robust packaging, and is acoustically isolated from the surrounding noise. The sensor has been designed in such a way that only CO₂ molecules can diffuse within the measurement chamber, while significantly attenuating the surrounding noise. As shown in Figure 1, the sensor performance remains within the specifications up to 101 dB SPL for pink noise, which is one of the most common signals in biological systems and is widely present in modern-day music.
   Figure 1. Acoustic robustness of XENSIV^TM PAS CO₂
   
   

   Infineon recommends that you isolate the sensor from vibration sources. The operating frequency of the sensor is 40 Hz. If vibration is expected at exactly 40 Hz with very high acceleration (≤ 0.3 g), you should do the following to minimize the vibration impact:

   • Mount the sensor in the X-direction of vibration.
   • Enable the denoiser filter.
   • Operate the sensor in continuous mode.

However, for a typical application, the impact of vibration is minimal. As shown in Figure 2, for a test setup with three sensors mounted on a commercially available air purifier, the test result shows that with the denoiser filter enabled, the sensor is robust against the vibration generated by a different fan of the air purifier.

 Figure 2. Vibration robustness of XENSIV^TM PAS CO₂

For more details, visit the CO₂ sensor website and see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.

2. How much indoor area can be covered by one sensor for a typical application?
   Even though CO₂ is generated locally, after a certain period, the CO₂ concentration is distributed throughout the room. Therefore, irrespective of the room size and number of people, the sensor is capable of accurately estimating the indoor CO₂ concentration within an indoor environment. For more details, see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.
   
   
3. Are scientific literature available indicating the harmful effects of CO₂ for human body?
   Several studies have been done on the effect of CO₂ on the human body at various concentration levels. The summary is provided in the chart. See Source [1] for the details of the study.
   
   

   Figure 3. Impact of CO₂ on the human body at various concentration levels

   Source
   

   1. https://www.sciencedirect.com/science/article/pii/S0160412018312807
   2. https://books.google.de/books?hl=en&lr=&id=TEnO6lILSj4C&oi=fnd&pg=PR8&dq=Co2+sensors+and+health&ots=Xy1umDNsmq&sig=ZjljEpPMeRBse75NgUiwbh01KuM&redir_esc=y#v=onepage&q=Co2%20sensors%20and%20health&f=false
   3. https://ieeexplore.ieee.org/abstract/document/8767280

4. Is it possible to obtain MEMS separately from the module along with the compensation software to integrate them into a custom DSP solution?
   No, currently it is not possible to purchase MEMS separately.
   
   
5. How is the sensor calibrated? Does it need recalibration after delivery?
   Each sensor is calibrated in the factory when it is shipped from Infineon. For the final product, you  will not have to perform calibration. However, you should use the automatic baseline offset correction (ABOC) feature during operation to minimize errors due to aging. See the application note, FCS_ABOC_XENSIV™ PASCO2.
   
   
6. How can I generate a known level of CO₂ in ppm?
   CO₂ sources are numerous such as bike tire CO₂ inflators, soda water, and human breath. To arrive at a known level, capture the CO₂ gas in a Tedlar bag and pump it into a gas chamber using a 6-V diaphragm pump. CO₂ concentration can easily reach more than 10000 ppm in such a setup. A reference CO₂ sensor can be used to measure the known level. See the application note, Recommended performance evaluation methodology for XENSIV™ PAS CO2 sensor.
   
   

   One such setup is as follows:
   

7. Can the XENSIV^TM PAS CO₂ sensors be battery-powered?
   XENSIV^TM PAS CO₂ can be used for battery-powered applications. Infineon has a reference design which can help operate the sensor at 3.3 V (a low-cost boost converter circuitry along with the sensor). For details, see the application note,

   XENSIV™ PAS CO2 for low-power application.

8. When is the CO₂ sensor available? Where can I get eval kits?
   

    

   Evaluation kits are already available with major distributors.

9. What are the power requirements of the XENSIV^TM PAS CO₂ sensor?
   The average power consumption to power up the sensor is 29.7 mW. During the measurement phase, the power consumption is 26.4 mW. Infineon provides a power calculator based on Microsoft Excel that helps in determining the average power consumption based on the end application.
   

   Figure 4. Average power consumption

   For more information, see Section 3 of the application note, XENSIV™ PAS CO2 for low-power applications.

10. What is the long-term stability of these sensors?
    

     With the automatic baseline offset correction (ABOC) feature enabled, the sensor accuracy drifts by 1% every year.

    

    Figure 5. Values of pressure and acoustic stability

    See Section 4.1.5 - Transfer function table in the datasheet.

11. How can I reduce a high CO₂ level?
    According to ASHRAE, an ideal living room should not have more than 1100 ppm of CO₂. Therefore, as soon as the CO₂ level increases beyond 1100 ppm, you should ventilate the room.
    
    
12. How is the sensor calibration done?
    
    • Does the sensor calibrate single gas or more gases?
    • How long does the calibration process take?
    • What is the required equipment?
    • How often calibration must be done?
    • Can the calibration be done anywhere or only in the laboratory?
    • Does the sensor have automatic calibration or auto leveling?

Each sensor is calibrated during our production for the complete operating range. Production calibration is done with highly accurate CO₂ gas bottle and verified with an ideal reference sensor.

The sensor might show small amount of offset after assembly due to stress generated from the assembly process on the light source. Therefore, to get the best performance, this offset should be corrected using either FCS or ABOC.

For the FCS calibration, you need to have a reference sensor. In the ABOC mechanism, the device keeps track of the minimum value recorded over a week. The offset to the reference baseline is computed and used to calculate the correction factor to be applied for the week after.

Figure 6. Operation of the ABOC feature

See the application note, After-assembly calibration scheme for XENSIV™ PAS CO2 for more details.

13. Can this device be installed on a microcontroller/system-on-chip such as Arduino/Raspberry Pi?
    Yes. Infineon provides C/C++ libraries for interfacing the sensor.
    See the following GitHub repos:
    
    • For devices compatible with Arduino.
    • For PSoC™ 6 MCU library.

14. Does the response time (T63 = 75s) meet the certification requirements and accuracy for medical applications?
    The sensor is not specifically designed to cover medical applications. However, the response time is defined based on the diffusion process.
15. What are the design rules for integrating the CO₂ sensor into a package for airflow speed and direction?The device must be positioned in such a way that the diffusion of CO₂ molecules can happen easily, with a large enough opening. The recommended opening is at least 14 mm x 14 mm.
    

     

    Figure 7. Airflow direction

 See the application note, General design in guidelines for XENSIV™ PAS CO2 sensor for details.

16. What is the time constant (CO₂) of the sensor?
    Time constant/response time of the sensor is the time it takes to measure the CO₂ concentration. This is due to the diffusion time of CO₂ molecules.
    For VDD3.3 = 3.3 V, VDD12 = 12 V, Tamb = 25°C, % RH = 30 %, p = 1013 hPa, the response time, T63 = 75 seconds.
    See Section 4.1.5 of the datasheet for more information.
    
    
17. What are the response times in different airflows?
    The response time is independent of the airflow. You should not place the sensor directly within the airflow. For more details, see the application note, General design in guidelines for XENSIV™ PAS CO2 sensor.
    
    
18. How do I waterproof the sensor board for wet environments?
    The sensor is not designed for applications where it must be waterproofed. The sensor may be damaged if submerged in water.
    
    
19. Is the CO₂ sensor tested in an environmental chamber?
    A test chamber is used, which  ensures that there is no leakage, and it can maintain laminar flow while exposing the sensor to the target gas concentration. Inside the test chamber, you should accommodate a reference CO2 sensor. Additionally, to get an overview of the complete test conditions, the pressure sensor, humidity sensor, and temperature sensor should also be considered.
    For more information, see the application note, Recommended performance evaluation methodology for XENSIV™ PAS CO2 sensor.
    
    
20. Can the sensor be used within battery-driven consumer goods, with a supply voltage lower than 12V, such as 3.3 V?
    Infineon has addressed the requirement; a reference design is available to ease the design process. You can use this design to realize 12V with relatively low effort. For more information, see the application note, Reference design Sensor2Go kit, and the detailed knowledge base article (KBA).
    
    
21. What are the major technologies used in the sensor?
    The sensor uses a microphone, emitter (MEMS + filter), and the embedded software that implements the sensing algorithm

Note: For more information, see the Community webpage for CO2 sensor where you can find answers to your questions and ask your own.

Version: **

Q1) What is Driver Signing?

Windows device installation uses digital signatures to verify the integrity of driver packages and to verify the identity of the vendor (software publisher) who provides the driver packages. In addition, the kernel-mode code signing policy for 64-bit versions of Windows Vista and later versions of Windows specifies that the kernel-mode driver must be signed for the driver to load.

All drivers for Windows 10 (starting with version 1507, Threshold 1) signed by the Hardware Dev Center are SHA2 signed. For details specific to operating system versions, see Signing requirements by version.

Q2) What is Driver resell or sharing a driver with Partner?

Driver resell is a process through which non-Microsoft organizations shares their Microsoft logo certified driver product with their customers and Partners. This process aids the partners to modify the driver package and get Microsoft Certification quickly without running certification test. This driver resell process follows Microsoft Driver Update Acceptable (DUA) process. So, driver package modification has few restrictions that are set by Microsoft DUA process.

Through this process, Cypress shares the Microsoft driver logo certification to the customer through the Windows Hardware Dashboard. By opting for driver resell, there is no need to run HLK compliance test for simple INF changes.

Q3) Why is Driver resell required?

Cypress provides device drivers for use with its USB devices and Bridge controllers ICs. These drivers are available for a number of Operating systems. However, many customers are interested in changing these drivers to reflect their corporate identity through custom USB VID, PID, product names, company names etc. This can be done by editing the driver INF files. However, the original driver logo certification gets cancelled due to the INF file changes.

This is when the customers can opt for Driver resell. The customers can obtain Microsoft certification for their device drivers.

Q4) What are the pre-requisites when opting for Driver resell?

Please refer to the following weblinks from Microsoft to understand about registering in the Windows Hardware Dashboard and obtaining an EV certificate:

>> https://docs.microsoft.com/en-us/windows-hardware/drivers/dashboard/register-for-the-hardware-program

>> https://docs.microsoft.com/en-us/windows-hardware/drivers/dashboard/get-a-code-signing-certificate

After creating an account in the Windows Hardware Dashboard, kindly reach out to Technical Support and provide the following details:

• The modified INF file with custom VID/PID for verification.
• The publisher display name.
• The OS for which they want the driver resell? Also mention whether it is needed for x64 OS architecture or x86 OS architecture or both?
• The driver version they want us to resell.
• The silicon chip they are using- FX3 or FX2LP or USB-Serial.

Q5) What are a few points to ensure while submitting the modified driver package?

• The modified INF file shared by the customer should not contain any IFX VID/PID (only valid for FX3/FX2 chips). FX2 and FX3 kits are used just for development purposes and not as end-products. Therefore, legally VID/PID of these kits should not be used by customers in their driver packages.
• The driver file names (inf/sys) should not be changed by the customer. Driver updates are carried out through a process termed DUA (Driver Update Acceptable Process). Driver resell process follows the same process as DUA. The restrictions on changes allowed in the driver package are not imposed by Cypress rather fall under the guidelines of the DUA process. Please refer to Section 2.2 Reselling (Redistributing) Drivers and the Driver Update Acceptable Process in Driver publishing workflow for Windows 10 by Microsoft - https://download.microsoft.com/download/B/A/8/BA89DCE0-DB25-4425-9EFF-1037E0BA06F9/windows10_driver_publishing_workflow.docx
• The INF files for different OS versions are different. To elaborate, the INF files for Windows XP and vista are the same. Similarly, the INF files for Windows 7-8.1 are the same but different from xp inf. The INF for Windows 10 is different from XP & Windows 7-8.1 INFs. Thus, the customers should submit different INF files corresponding to the OS versions for which they want us to do driver resell. For instance, if they want driver resell for all the OS versions, they need to submit 3 different INFs-
  •   for XP and Vista
  •   for Windows 7-8.1
  •   for Windows 10

Kindly check the Drivers folder in the FX3 SDK: https://www.cypress.com/documentation/software-and-drivers/ez-usb-fx3-software-development-kit

Q6) Does Cypress performs driver resell for both the Cypress CDC (Virtual COM port) driver and cyusb3 driver?

Yes, we do driver resell (Redistribution) for both CDC (Virtual COM port) driver and cyusb3 driver. The driver resell process is the same for both drivers.

Q7) Does Cypress sign the driver files and create a new CAT file?

No, we do not sign the CAT file. Cypress is not allowed to sign driver package containing non-Cypress VID and PID due to legal constraints. We can help to sign drivers which contain only Cypress VID.

Q8) What should be done after receiving the driver package from Cypress?

Please refer to Section 3. Driver Resell in CyUSB.pdf (<Installation path>\EZ-USB FX3 SDK\1.3\doc\SuiteUSB\CyUSB.pdf) document present in EZ-USB FX3 SDK (https://www.cypress.com/documentation/software-and-drivers/ez-usb-fx3-software-development-kit

For details please refer to CyUSB.pdf in the EZ-USB FX3 SDK: https://www.cypress.com/documentation/software-and-drivers/ez-usb-fx3-software-development-kit

Windows Hardware Center Dashboard: https://docs.microsoft.com/en-us/windows-hardware/drivers/dashboard/?redirectedfrom=MSDN

Version: **

Question:
The ToString operation with the CyUSBStorDevice class of the C# library (CYUSB.NET) returns wrong manufacturer and product string. How can we fix it?

Answer:
The support for the mass storage class has been removed from the C# library (CYUSB.NET). The details are still maintained in the documentation for the existing customers. It is not recommended to use this class in new designs.

Version: **

Normally, you can track the producer and consumer events in the DMA callback to verify that the consumer socket has no data in the queue and all committed buffers are consumed. If it is not possible to use this method, use the following alternative to verify that the consumer socket has no data in the queue and all the committed buffers are consumed.

Use this method when a certain amount of DMA transfers is completed, and no more producer events are expected. At this point, the consumer socket will be in stall state. The socket will be in stall state when it is waiting for data to be loaded into the Fetch Queue or waiting for an event. See sections 5.5.5 and 5.5.7 of EZ-USB FX3 Technical Reference Manual for more details.

Use the following code snippet to check to check for the stall status:  

Note that it may not be a good idea to check for the stall status while a DMA transfer is ongoing because if the rate at which data is produced is significantly less than the rate at which the data is consumed, the socket goes to the stall state, waiting for more data.

English version: https://community.cypress.com/t5/Knowledge-Base-Articles/Port-applications-across-EZ-PD-PMG1-MCUs-KBA232685/ta-p/268600

Translated by:MaMi_1205306

Author: SananyaM_56           Version: **

このKBAでは、USB電力供給 (PD)に EZ-PD PMG1 (Power Delivery Microcontroller Gen1) MCUを使用するアプリケーションにUSB2.0データ機能を追加する方法について説明します。

1. PMG1-S0:

従来のUSB充電（BC1.2およびApple Charging）のサポートが必要な場合は、USB 2.0 D +、D-ラインをType-CコネクタからPMG1-S0 MCUに接続できます。 USB 2.0データの使用事例としては、システムのUSB2.0コントローラーに直接接続できます。

図1はレガシーUSB充電をサポートするためのPMG1-S0（部品番号：CYPM1011-24LQXI）との接続例を示しています。

図 1

 

 

 

 2. PMG1-S1:

PMG1-S1 MCUは、従来の充電検出をサポートする内部USB 2.0アナログMUXをサポートします。 したがって、Type-CコネクタのD +、D-ピンの両方のセットをPMG1-S1に接続できます。 Type-C方向の検出に基づいて、対応するD +、D-（上/下）は、内部USB 2.0 MUXを使用してUSBDP_SYS、USBDM_SYSピンに経路が決定されます。 USBDP_SYS、USBDM_SYSピンを外部USB 2.0コントローラーに接続して、データ転送をサポートできます。

図2は、PMG1-S1（部品番号：CYPM1111-40LQXI）との接続例を示しています。

図 2

 

 

 

3. PMG1-S2:

PMG1-S2 MCUは、統合されたUSBフルスピードコントローラーが含まれています。 そのため、Type-CコネクタのD +、D-ピンをPMG1-S2のUSBDPピンとUSBDMピンに接続し、レガシー充電とUSB 2.0データの両方を可能にし、外部USB2.0コントローラーが不要になります。

図3は、PMG1-S2（部品番号：CYPM1211-40LQXI）との接続例を示しています。

図 3

 

 

 

English: https://community.cypress.com/t5/Knowledge-Base-Articles/Port-applications-across-EZ-PD-PMG1-MCUs-KB...

Translated by: MaMi_1205306

Version: **

EZ-PD™PMG1 (Power Delivery Microcontroller Gen1)は、高電圧USB Power Delivery (USB PD)マイクロコントローラー(MCU)のファミリーです。これらのチップには、アナログおよびデジタル周辺機器に加えて、Arm®Cortex®M0PUおよびUSBPDコントローラーが含まれます。 PMG1デバイスのアプリケーション/ファームウェア開発は、ModusToolbox®ソフトウェア環境でサポートされています。

(https://www.cypress.com/products/modustoolbox-software-environment)

ModusToolboxは、アプリケーション開発サイクルにおける任意の時点で、あるボードから別のボードにアプリケーションを移植する柔軟性を提供します。 EZ-PD PMG1プロトタイピングキットを含むさまざまなMCUボード用のボードサポートパッケージ（BSP）を提供します。 BSPは、ボード/デバイスのハードウェアレベルの仕様を抽象化し、MCU /ボード全体で一貫性のあるAPIとマクロの共通セットを提供します。ミドルウェアとユーザーのアプリケーションは、BSPを使用してハードウェアを構成および制御できます。

ボードサポートパッケージは、次のもので構成されています。

• デバイスのハードウェア構成ファイル
• デバイスの起動コードとリンカーファイル
• キットをサポートするために必要なその他のライブラリ

表1にPMG1プロトタイピングキットとそれに対応するBSPを示します。ユーザーは特定のハードウェアボード用に独自のBSPを作成できます。

表1. EZ-PDPMG1プロトタイピングキットと対応するBSP

1つのMCU用で作成されたプロジェクトは、機能/機能/リソースの移植が新しいMCUでサポートされている場合、PMG1ファミリの他のMCUに移植できます。 PMG1 MCU間でプロジェクトを移植するには、次の手順を参照してください。

1. Quick PanelのTools sectionから “Library Manager”を開きます。

図1. Quick PanelのLibrary Manager

2. Library Managerの場合:
3. プロジェクトの移植先となる新しいBSPを選択します。 削除する古いBSPのチェックを外します。 そのハードウェア用に作成されたカスタムBSPを選択して、プロジェクトをカスタムハードウェアに移植することもできます。 図2は、PMG1-CY7110からPMG1-CY7111プロトタイピングキットへのアプリケーションの移植を示しています。
4. Updateをクリックします。

図2. LibraryManagerでプロジェクトを新しいBSPへ移植

3. MakefileでTARGET名を前の手順で選択した新しいBSPに変更します。

図3. MakefileでTARGET名を変更

4. Quick Panelの場合:
5.  <project name>のGenetate launchesをクリック。
6. Refresh Quick Panelをクリック。

図4. launch comfigurationのR再生成

これで、図5に示すように、Device Configuratorが新しいBSPに更新されます。移植中に古いBSPで使用されていたリソース/機能が新しいBSPでもサポートされていることを確認してください。

図5. 新しいBSPに更新されたDevice configurator

Original KBA: FX3: USB transfers do not occur even after data is committed to USB socket – KBA231898

Translated by: Kenshow

タイトル： FX3：データがUSBソケットにコミットされた後でもUSB転送は発生しません– KBA231898

バージョン：  **

FX3 SDK 1.3.4では、CyU3PConnectState() APIを使用してUSB接続を設定する前にUSBソケットに関連付けられたDMAチャネルを作成すると、USBソケットへのデータのコミットに成功してもUSB転送が発生しない場合があります(CyU3PDmaChannelCommitBuffer()またはCyU3PDmaMultiChannelCommitBuffer() APIはCY_U3P_SUCCESSを返します)。シナリオ例を図1と図2に示します。

図1. USBソケットにコミットされたDMAバッファを示すUARTデバッグプリント

図2. USBコントロールセンタからのUSBIN転送が失敗する

ノート：

1. エラーコード997は、FX3にUSBホストに転送するデータがない場合に発生するタイムアウトエラーです。
2. FX3 DMAチャネル、DMAバッファ、およびソケットの詳細については、EZ-USBFX3テクニカルリファレンスマニュアルを参照してください。
3. USBコントロールセンタを使用したFX3へのデータ転送のプログラミングと実行については、AN75705：EZ-USBFX3入門を参照してください。

この問題は、FX3 SDKリリースノートに記載されている既知の問題が原因で発生する可能性があり、USB デバイスモードでの接続開始時に USB ソケットに関連付けられた DMA チャンネルの設定が無効になる可能性があることに言及しています。

この問題を回避するには、CyU3PDmaChannelReset（）またはCyU3PDma-MultiChannelReset（）APIを使用してDMAチャネルをリセットし、各エニュメレートサイクルの後に再度有効にする必要があります。これは、CY_U3P_USB_EVENT_SETCONFイベントが発生したときに実行でき、USBデバイスが正常にエニュメレートされたことを示します。CY_U3P_USB_EVENT_SETCONFイベントの前に、USBソケットに関連付けられたDMAチャネルを使用しないでください。