When the fault event is removed the device will recover automatically and no external reset is required.
The device has the following behavior during various fault events:
- Open load: the chip switches off. An OL condition is detected when VPS < VPS(OL) (P_8.3.10) for more than tOL (P_8.3.9). During the OL fault VOUT=Vs-VPS(OL). If the causing event is not present anymore, output will turn on again.
- Short circuit to GND: the chip switches off. A SC condition is detected when VOUT < VOUT(SC) (P_8.3.11) for more than tSC (P_8.3.12). If the causing event is not present anymore, output will turn on again.
- Over load: when the temperature exceeds certain threshold, Tj > Tj(CRT) (P_9.2.13), output current is reduced through IN_SET pin voltage (P_8.3.1), and eventually it will drop to zero if temperature continues to rise. When chip cools down, output current will regulate again.
- Reverse battery: chip integrates a protection mechanism against these events down to -16V (P_4.1.1). For events of high ISO-pulse requirements (VS < -16V) a reverse protection diode is needed (similar to Basic+). Reverse output current IOUT(rev)=3uA (P_9.2.3) (leakage current).
