SMD and NSMD pad type for BGA package
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Sep 13, 2021
04:59 AM
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Sep 13, 2021
04:59 AM
There are two types of land pad patterns: Solder Mask Defined (SMD) pad and Non-Solder Mask Defined (NSMD) pad. The land pad pattern type differs depending on the solder mask opening.
Difference between SMD and NSMD pad types
Solder mask defined (SMD) pad type |
Non-solder mask defined (NSMD) pad type |
In SMD pad type, the solder mask opening is smaller than the metal ball land pad. |
In NSMD pad type, the solder mask opening is bigger than the metal ball land pad. |
Select the SMD pad type to minimize underfill issues during the surface mount assembly process. |
Select the NSMD pad type when board-level mechanical performance is important. |
The solder mask prevents solder to spill over the pad’s edge. |
There is a gap between solder pad and solder mask in which the solder flows and strengthens the bond. |
Consider the following table to select a PCB land pad pattern type when designing hardware with BGA package FAB024. See Figure1.
Figure 1
Source: KBA233770
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- bga
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- fl-s
- fs-s
- hardware design
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- hs-t
- land pad pattern
- Non-Solder Mask Defined (NSMD) pad
- nor flash
- NSMD
- package
- pcb design
- smd
- Solder Mask Defined (SMD) pad
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