OptiMOS™ 5: When to use TOLG devices over traditional TOLL devices? (KA-03294)
* In applications where the temperature cycles regularly vary over a wide range (for example 25°C to 100°C) and where aluminum-insulated metal substrate is used in place of PCB materials such as FR4.
* TOLG also takes up significantly less board area than other SMD power packages such as D2PAK. Hence they combine the power density achieved with TOLL with the mechanical reliability of D2PAK.