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OptiMOS™ 5: Advantage of negative standoff in TOLT devices (KA-03297)

OptiMOS™ 5: Advantage of negative standoff in TOLT devices (KA-03297)

BinduPriya_G
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OptiMOS™ 5: Advantage of negative standoff in TOLT devices (KA-03297)

The TOLT device leads are formed so that they will never extend beyond the edge of the package. This ensures that the package will always lie flat on the PCB to minimize the effect of tolerances that would cause variation in Thermal Interface Material (TIM) thickness. While doing this, the junction to ambient thermal resistance remains optimized and tightly controlled.

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