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Mold compound of IPLU300N04S4-R8, temperature limit (KA-01022)

Mold compound of IPLU300N04S4-R8, temperature limit (KA-01022)

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Mold compound of IPLU300N04S4-R8, temperature limit (KA-01022)

The mold mass compound for IPLU300N04S4-R8 is KMC 2110 G-7. The material has a glass transition temperature of:
Nominal value: 135 °C
Lower specification limit: 120 °C
Upper specification limit: 150 °C
Melting of the epoxy resin is not to be expected. The mold compound is a duroplast. The characteristic of these plastics is that they interconnect like a grid and do not melt at higher temperatures. The question of the melting and softening temperature is only relevant for thermoplastics.
For more information please refer to the ICP and SGS reports, which can be requested using the form at https://www.infineon.com/tac

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