Community Translated by KoKi_1693136 Version: **
Translation - English: Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416
質問：
良く使用されている Cypress パッケージ用の推奨ランドパターンはどのようなものがありますか？
回答：
良く使用されている Cypress のパッケージには以下のようなものがあります。
100-Ball Ball Grid Array (6.0 × 6.0 × 1.0 mm) | 100 Ball BGA |
44-Pin Thin Small Outline Package Type II | 44 Pin TSOP II |
54-Pin Thin Small Outline Package Type II | 54 Pin TSOP II |
48-Pin Thin Small Outline Package Type I | 48 Pin TSOP I |
28-Pin Thin Small Outline Package | 28 Pin TSOP |
64-Ball Fortified Ball Grid Array (13 x 11 mm) | 64 Ball FBGA 13x11 |
8-Pin Small Outline Integrated Circuit (208 mils) | 8 Pin SOIC 208 mils |
8-Pin Dual Flat No Leads (5x6x0.75 mm) | 8 Pin DFN |
8-Pin Ultra-Thin Small Outline No-lead Package | 8 Pin USON |
64-Ball Fortified Ball Grid Array (9x9mm) | 64 Ball FBGA 9x9 |
16-Pin Quad Flat No-Leads (3 x 3 x 0.6 mm) | 16 Pin QFN |
8-Pin Small Outline Integrated Circuit (150 mils) | 8 Pin SOIC 150 mils |
100-Pin Thin Quad Flat Package (14 x 14 x 1.4 mm) 6-pin Ceramic LCC (5 x 3.2 x 1.30 mm) 8-pin Quad Flat No-Leads (3.28 x 3.28 x 0.55 mm) 16-pin Small Outline Integrated Circuit 24-pin Quad Flat No-Leads 32-Pin Thin Small Outline Package Type II 32-Pin Thin Small Outline Package Type I 48-pin Quad Flat No-Leads 48-Ball Very Fine Pitch Ball Grid Array 361-Ball Flip Chip Ball Grid Array | 100 Pin TQFP 6 pin LCC 8 pin GQFN 16 pin SOIC 24 pin QFN 32 pin TSOP II 32 pin TSOP I 48 pin QFN 48 Ball VFBGA 361 Ball FCBGA |
