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Guarantee of solderability

Guarantee of solderability

Infineon_Team
Employee
Employee
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Non Dry Pack: 24 months (at 5-40°C and 10% - 75% humidity)
Dry Pack: 36 months (at 5-40°C and <90% humidity)
Gold contact, Card Modules (Chipcard): 36 months (at 5-40°C and 10% - 75% humidity)
IGBT Modules with screw terminals: 60 months (at 5-40°C and 10% - 75% humidity)
Pressure contact discs – hermetically sealed: 120 months (at 5-40°C and 10% - 75% humidity)

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