Connecting the exposed pad to OPTIGA™ Connect IoT - KBA235902
Community Translation: 露出パッドとOPTIGA™ Connect IoTとの接続 - KBA235902
The exposed die pad is used for cooling purposes and to allow better heat dissipation. It should be placed on the bottom side of the VQFN-8-4 package layout. The exposed die pad, referenced as (C) in the following figure, must be connected to the common ground reference (GND) for heat distribution. This ensures a big copper plane for optimal thermal dissipation and avoids electrostatic discharge (ESD).
The contacts and their functionality are given in the following table