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The exposed die pad is used for cooling purposes and to allow better heat dissipation. It should be placed on the bottom side of the VQFN-8-4 package layout. The exposed die pad, referenced as (C) in the following figure, must be connected to the common ground reference (GND) for heat distribution. This ensures a big copper plane for optimal thermal dissipation and avoids electrostatic discharge (ESD).
The contacts and their functionality are given in the following table
