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BGA substrate size of BGA package flash device – KBA236219

BGA substrate size of BGA package flash device – KBA236219

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Community Translation: BGA パッケージ フラッシュ デバイスの BGA 基板サイズ – KBA236219

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The substrate size of the flash device, also known as the solder mask opening of the flash device, is not always made available to the customer for SMD flash memory packages. In the flash datasheet’s Physical Diagrams, the value can be referred to as the minimum solder ball size. For example, the nominal ball size and ball pitch for the S25FS064S FAB024 BGA 24-ball 6x8 mm package are 0.4 mm and 1.00 mm, respectively. In this case, the substrate size of the flash device can be as small as the minimum solder ball size of 0.35 mm.

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Figure 1  Substrate size
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